Proceedings International Test Conference 1998 (IEEE Cat. No.98CH36270)
DOI: 10.1109/test.1998.743197
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Failure mechanisms and fault classes for CMOS-compatible microelectromechanical systems

Abstract: Silicon-compatible micromachining provides a low cost monolithic solution for the integration of microelectromechanical systems (MEMS). In the last years, C M P (the French MultiProject Wafer Service) has made available technological solutions f o r the fabrication of CMOS-compatible MEMS. Numerous monolithic devices have been fabricated using this service. The inspection of failed devices has allowed the identification of the most typical failure mechanisms and design errors f o r this type of MEMS. This valu… Show more

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Cited by 26 publications
(5 citation statements)
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“…Among the failure mechanisms or defects which can appear during fabrication, defects occurring during the CMOS process can be distinguished from defects occurring during micromachining (Castillejo et al, 1998); (Mir et al, 2000); (Huang et al, 2012). Microelectronic and micromechanical components are created on the wafer during the CMOS process by means of a set of semiconductor, conductor and dielectric layers.…”
Section: Failure Mechanisms and Fault Classesmentioning
confidence: 99%
“…Among the failure mechanisms or defects which can appear during fabrication, defects occurring during the CMOS process can be distinguished from defects occurring during micromachining (Castillejo et al, 1998); (Mir et al, 2000); (Huang et al, 2012). Microelectronic and micromechanical components are created on the wafer during the CMOS process by means of a set of semiconductor, conductor and dielectric layers.…”
Section: Failure Mechanisms and Fault Classesmentioning
confidence: 99%
“…The sort of defects that can occur in these kind of structures can be determined from observations of failed devices. In [17] the most typical failure mechanisms in a bulk micromachining process are identified for each technology step together with the faults & deviating parameters caused by those mechanisms.…”
Section: Transducer Fault Modelling and Simulationmentioning
confidence: 99%
“…Layout of the sensor/actuator The sort of defects that can occur in these kind of structures can be determined from observations of failed devices. In [17] the most typical failure mechanisms in a bulk micromachining process are identified for each technology step together with the faults & deviating parameters caused by those mechanisms.…”
Section: Defect Descriptions and Statisticsmentioning
confidence: 99%