2018 IEEE International Power Electronics and Application Conference and Exposition (PEAC) 2018
DOI: 10.1109/peac.2018.8590288
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Fast Electro-thermal Simulation Strategy for SiC MOSFETs Based on Power Loss Mapping

Abstract: A fast electro-thermal simulation strategy for SiC power MOSFETs is presented in this paper. This approach features the detailed mapping of the device power losses under a wide range of operating conditions by using a compact electrical model and its experimental validation for a 1.2 kV/ 36 A commercial device. The losses condition map is used in the simplified model of a half-bridge inverter topology. The average device losses per switching period are injected into a multi-layer thermal impedance network obta… Show more

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Cited by 12 publications
(12 citation statements)
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“…Microscopic thermal models make it possible to determine time-spatial distribution of the temperature of electronic components [75]. In contrast, compact thermal models make it possible to determine waveforms of one internal temperature, characterising the thermal state of each semiconductor device [76].…”
Section: Thermal Phenomena In Power Convertersmentioning
confidence: 99%
“…Microscopic thermal models make it possible to determine time-spatial distribution of the temperature of electronic components [75]. In contrast, compact thermal models make it possible to determine waveforms of one internal temperature, characterising the thermal state of each semiconductor device [76].…”
Section: Thermal Phenomena In Power Convertersmentioning
confidence: 99%
“…The usefulness of time-domain system models in these roles is dependent on their accuracy, convergence reliability, and simulation speed. However, there are significant challenges in achieving all three criteria simultaneously [5], especially when modeling fast-switching semiconductors, such as wide bandgap (WBG) devices [6], or multi-level converter topologies [7]. Because adoption of these two technologies is increasing in industry [1], [8], [9], application engineers have a strong motivation for understanding the performance tradeoffs associated with model design features.…”
Section: Introductionmentioning
confidence: 99%
“…However, failure characterization and lifetime assessment are still challenging problems in SiC devices [2,6]. Considering the differences of failure mechanisms in the conventional Silicon-based power modules, novel reliability monitoring technique is demanded to characterise all sorts of failure mechanisms in WBG devices [2,[7][8][9]. Condition Monitoring (CM) is a passive technique for assessing the switch degradation level and the health of the power module [2,10,11].…”
Section: Introductionmentioning
confidence: 99%
“…Thermo-mechanical cycling, caused by Coefficient of Thermal Expansion (CTE) mismatch during commonly higher temperature operation, is cited as the main factor in switch package-level degradation [2,9]. The main outcome of the switch degradation is mostly in the form of WB-related (WB heel cracking, WB lift-off, and WB fracture) or solder-related (solder cracking, solder delamination, and solder joint fatigue) failure modes [2].…”
Section: Introductionmentioning
confidence: 99%