2003
DOI: 10.1177/0014485103036022
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Fatigue Damage Evolution in Silicon Films for Micromechanical Applications

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Cited by 4 publications
(5 citation statements)
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“…LEFM is a straightforward, although complex, concept that deals with sharp cracks in elastic forms [ 112 ]. The basic fundamentals of fracture mechanics may be summarized as manner of a triangle with three critical constraints positioned at each apex: operational stress, fracture toughness and critical defect size [ 113 ].…”
Section: Early Facture Testingmentioning
confidence: 99%
“…LEFM is a straightforward, although complex, concept that deals with sharp cracks in elastic forms [ 112 ]. The basic fundamentals of fracture mechanics may be summarized as manner of a triangle with three critical constraints positioned at each apex: operational stress, fracture toughness and critical defect size [ 113 ].…”
Section: Early Facture Testingmentioning
confidence: 99%
“…One drawback of this model as stated by Kahn et al [314] is that cyclic stressenhanced oxidation has never previously been observed. Though Allameh et al [317,318] report that their specimens had an initial surface oxide of 2À4 nm, they used the same structures as Muhlstein et al [309], who showed surface oxides of about 30 nm. Another concern is that Allameh et al…”
Section: Polysiliconmentioning
confidence: 99%
“…1 Subsequently, several groups have confirmed that both micron-sized samples of single-crystal and polycrystalline silicon undergo fatigue failure. [2][3][4] However, a recent experiment calls into question these studies by observing similar cracking behavior in both cyclic-and monotonic-loaded micromachined silicons. 5 Kahn et al 6 has compiled and summarized the main experimental observations of silicon fatigue failure as follows: ͑1͒ morphological changes in areas of high stress, including surface roughening and oxide thickening, ͑2͒ a decrease in high cycle fatigue lifetime when the peak stress is increased, ͑3͒ a decrease in low cycle fatigue lifetime when R, the ratio between minimum and maximum stress ͑negative values denote compression͒, is decreased, ͑4͒ a decrease in fatigue lifetime associated with a larger initial flaw, which is assumed to be caused by subcritical crack growth, ͑5͒ no dependence on vacuum or air in fatigue lifetime for low cycle failure, but a significant decrease in lifetime during high cycle fatigue if water is present, and ͑6͒ a fatigue lifetime that depends only on the number of cycles, not the elapsed time or the test frequency.…”
Section: Introductionmentioning
confidence: 99%
“…7 Other experiments indirectly detect the influence of stress by measuring the oxide thickness in the crack tip region, often in postmortem studies. 2,3 Large-scale hybrid quantum-mechanical/empirical potential simulations 8,9 predict that the dissociation of water molecules in a crack tip region under tension is barrierless. In contrast, ab initio simulation of water interacting with a strained silicon cluster found no evidence for enhanced chemical reactivity.…”
Section: Introductionmentioning
confidence: 99%