Fatigue life prediction of Package-on-Package stacking assembly under random vibration loading

Dirlik and Tovo-Benasciutti Spectral Methods in Vibration Fatigue: A Review with a Historical Perspective

“…In the former cases, for example, spectral methods combined with finite element analysis are employed for the virtual qualification of electronic assemblies subjected to aerospace vibratory environment [60]. Other examples with electronic devices [61,62] are discussed in the following section. Concerning composite materials, spectral based approaches attempt to reformulate strength criteria for composite materials (e.g., Tsai-Hill [63], residual strength, or stiffness model [64,65]) to extend their validity to the frequency domain for the case of random vibrations [66].…”

“…A comparison with experimental data is provided in [61,62] for electronic devices subjected to random loadings, with particular attention on the structural integrity of solder joints in two architectures called package-on-package (PoP) and ball grid array (BGA). Interestingly, the study also pointed out how the two spectral methods "give a very similar fatigue life" [80], despite showing essential differences in their rainflow probability distributions.…”

Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies

“…A new fatigue equation with vibration frequency and cracking energy density considerations was proposed by Lee and Jeong (2014) for solder joints. S-N curve dependency of packaging architecture and arrangement was discovered and numerated by Xia et al (2017b) and supported with three-dimensional FEM simulations of micro-scale chip scale package under cyclic mechanical loadings (Han et al, 2017). An FEM-based random vibration model for BGA solder joints fatigue lifetime estimation was proposed by Zarmai et al (2017) and confirmed via experimental random vibration testing.…”

An investigation on mechanical random vibration fatigue damage of solder joints in electronic systems

“…A condition monitoring technique was reported in Mishra et al (2002), Pippola et al (2014) to characterize the effects of mechanical stresses on the electronic devices and PCB thanks to the physics of failure analysis. Plastic BGAs lifetime estimation under both severe thermal cycling and random vibration was investigated in Xia et al (2017). The results revealed that the thermomechanical fatigue of the joints were accelerated after exposing to the thermal cycle loading.…”