FDTD analysis of high frequency electronic interconnection effects

Cherry, P.C.; Iskander, Magdy F.

doi:10.1109/22.466178

Cited by 45 publications

(14 citation statements)

References 16 publications

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“…Hence, it requires only one LU decomposition and forward-backward substitutions to compute moments. Also, it is easy to note that the lumped networks are a special case of (107) [where for , in which case (107) reduces to the form given by (104)]. Next, (107) requires the derivatives of .…”

Section: B Computation Of Momentsmentioning

confidence: 97%

Simulation of high-speed interconnects

2001

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With the rapid developments in very large-scale integration (VLSI) technology, design and computer-aided design (CAD) techniques, at both the chip and package level, the operating frequencies are fast reaching the vicinity of gigahertz and switching times are getting to the subnanosecond levels. The ever increasing quest for high-speed applications is placing higher demands on interconnect performance and highlighted the previously negligible effects of interconnects, such as ringing, signal delay, distortion, reflections, and crosstalk. In this review paper, various high-speed interconnect effects are briefly discussed. In addition, recent advances in transmission line macromodeling techniques are presented. Also, simulation of high-speed interconnects using model-reduction-based algorithms is discussed in detail.

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Section: B Computation Of Momentsmentioning

confidence: 97%

Simulation of high-speed interconnects

2001

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“…Typically, a package usually has more than one layer of metalization, where different signal lines and ground planes are etched [1]. Also, there are several transitions (via holes) to transmit the signal to the other lines and to connect the ground planes at the different layers of the package [2][3][4]. In general, mutual-coupling effects in these packages are due to the presence of multiple signal lines at the same or different metalization layers and transition discontinuities (via holes) between the different layers in a package are considered to be another source of coupling effects.…”

Section: Introductionmentioning

confidence: 99%

Analysis and characterization of package resonance

El-Sharawy

Ghouz

2004

Int J RF and Microwave Comp Aid Eng

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This article presents FDTD analysis and prediction of the overall effects of the resonance in ceramic and plastic packages. Practical structures that result in strong resonance effects are investigated, such as coupled cross lines with a via transition and multiple via transitions on a single line. A detailed study of the mutual coupling, including resonance effects, is also performed and presented. The results of the analysis indicate that the package performance can be very sensitive to the resonance effects. A broadband equivalent-circuit model for multiple transition discontinuities (two via holes) on a single line has been developed and presented. Good agreement between the frequency response of the FDTD and the circuit models has been achieved over a broad band of frequencies. The analysis presented in this article provides insight about the limits at which coupling effects on the overall package performance can be neglected. The equivalent-circuit model presented in this article can greatly simplify the analysis and simulation of a complex package, including several transition discontinuities, assuming that the coupling is small.

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“…In order to solve for E c , we apply the Galerkin Method of Moments to equation (2), under the boundary condition (1a). The trial functions φ k ( φ k = 0 on the metal) verify the boundary condition (1b).…”

Section: Computation Of the Input Admittance Matrixmentioning

confidence: 99%

“…In the literature many techniques have been suggested to characterize these discontinuities [1][2][3][4][5]. The Finite Difference Time Domain method (FDTD) [1,2] and the Finite Element Method (FEM) [3,4] have been used to provide accurate modeling of the discontinuities. Even though these methods are accurate, they are highly expensive in computational time.…”

Section: Introductionmentioning

confidence: 99%