Feasibility study of two-phase immersion cooling in closed electronic device

Wada, Mizuki; Matsunaga, Arihiro; Hachiya, Mahiro; Chiba, Masaki; Ishihara, Kunihiko; Yoshikawa, Minoru

doi:10.1109/itherm.2017.7992581

Cited by 7 publications

(3 citation statements)

References 2 publications

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“…Two-phase immersion cooling, commonly known as pool boiling, has been successfully used in electronic equipment heat management system [96,97]. The system's electronic components submerge in a tank filled with boiling volatile dielectric coolant [51,98]. The heat produced by the electrical device is efficiently absorbed as saturated vapour, which can then condense and transmit the heat to an external cooling medium.…”

Section: Two-phase Immersion Coolingmentioning

confidence: 99%

Heat management technology for solid‐state high voltage and high repetitive pulse generators: Towards better effects and reliability

et al. 2023

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Solid‐state high voltage high repetitive pulse generators have a broad prospect in various applications. The high power and high‐frequency operation of the pulse generator suffer from the massive heat dissipation problem, which limits the improvement of the output parameters and even affects the lifetime. This article focuses on heat management technology for high voltage high repetitive pulse generators. Firstly, the typical circuit topology of the high repetitive pulse generators was summarised. From the perspective of different application requirements, the demands of the heat management design were concluded. Moreover, the heat generation characteristics and difficulties of solid‐state high voltage high repetitive pulse generators were analysed. Then, the different state‐of‐art cooling techniques were reviewed, and their applicability and limitations for the high voltage high repetitive generators were discussed. Finally, a flow chart for heat management design was given.

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Section: Two-phase Immersion Coolingmentioning

confidence: 99%

Heat management technology for solid‐state high voltage and high repetitive pulse generators: Towards better effects and reliability

et al. 2023

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“…Although recent researches trends are concerned to micro scales designs based on every year smaller space available (ARIK et al, 2013;COLLA et al, 2017;FABBRI;DHIR, 2005;SAFFARIPOUR;CULHAM, 2010), the evaluation of finned heatsinks or other traditional cooling methods are still of great usage, especially at electronic cooling systems and LED illumination systems cooling (CHENG et al, 2010;DALIANG ZHONG et al, 2010;KOTLAR;SVASTA, 2017;NONNEMAN et al, 2018;WADA et al, 2017;ZHU et al, 2017). In the thermal design of heatsinks, in order to make a proper use of the convective heat transfer coefficient in the heat sink thermal analysis, it is necessary to employ in Eq.…”

Section: Armentioning

confidence: 99%

Mean Nusselt Number Correlation for Tise Heatsink Thermal Design

Sato

Altemani

Scalon

2020

RETERM

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This work was developed from a review of the technical literature for the thermal design of parallel plates heat sinks with uniform cross section cooled by airflow with the TISE (Top Inlet Side Exit) configuration. Due to an observed lack of agreement of the literature correlations among themselves and also with the available experimental results, numerical simulations were then performed to evaluate the forced convective heat transfer in the channels of these heat sinks with the TISE configuration. The simulations encompassed a range of heatsink airflow rates, considering distinct channel sizes and also the effect of a partial opening for the airflow entrance at the heat sink top. The obtained numerical results were employed to evaluate the average convective heat transfer coefficient inside the heatsink’s channels, based on the flow mixed mean temperature. A new empirical correlation was then proposed for the average Nusselt number as a function of the airflow Reynolds number and three dimensionless channel geometric parameters. The new correlation was compared with available experimental data.

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“…For instance, jet impingement cooling thrusts a fluid jet onto a surface that is to be cooled, thereby minimizing the boundary layer effect and significantly improving the (local) heat transfer coefficient [3][4][5]. Also, immersion cooling has recently drawn attention, whereby the heat dissipating components are submerged into a thermally conductive dielectric liquid [6]. Since in both approaches the working fluid must be contained somehow or the thermal benefits are experienced only very locally, this poses constraints on the overall design of the electronics (cooling) system.…”

Section: Introductionmentioning

confidence: 99%

Experimental Performance of a 3D-Printed Hybrid Heat Pipe-Thermosyphon for Cooling of Power Electronics

Wits

2018

2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

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This paper presents an innovative metal 3D-printed hybrid heat pipe-thermosyphon for cooling of power electronics. This hybrid device has an evaporator design based on heat pipe technology, while the condenser design is based on a thermosyphon. An array of cubic fins is 3D printed on the inner surface of the evaporator bottom plate to enhance capillarity and evaporation rates. The thermal performance of the additively manufactured heat pipe-thermosyphon, fabricated from aluminium alloy, was examined under vertical orientation using acetone as the working fluid. Experiments were conducted to determine thermal resistances of the device by instrumenting thermocouples along the wall. The effects of liquid filling ratio and heat flux were examined. The results show that for a heat flux of 35 W/cm 2 a liquid filling ratio of 30% gave the best performance with a minimum evaporation, condensation and total thermal resistance of 0.086, 0.17 and 0.26 K/W, respectively.

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Feasibility study of two-phase immersion cooling in closed electronic device

Cited by 7 publications

References 2 publications

Heat management technology for solid‐state high voltage and high repetitive pulse generators: Towards better effects and reliability

Heat management technology for solid‐state high voltage and high repetitive pulse generators: Towards better effects and reliability

Mean Nusselt Number Correlation for Tise Heatsink Thermal Design

Experimental Performance of a 3D-Printed Hybrid Heat Pipe-Thermosyphon for Cooling of Power Electronics

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