2011
DOI: 10.7567/jjap.50.04dd09
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Ferroelectric-Gate Thin-Film Transistor Fabricated by Total Solution Deposition Process

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Cited by 17 publications
(11 citation statements)
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“…Figure 3(b) shows the electrical quantities, voltage, current and electric power applied on P1. Usually, PZT actuator is considered as a capacitance load [ 20 , 21 ]. The phase difference between voltage and current is approximately 80.9° in Figure 3(b) .…”
Section: Resultsmentioning
confidence: 99%
“…Figure 3(b) shows the electrical quantities, voltage, current and electric power applied on P1. Usually, PZT actuator is considered as a capacitance load [ 20 , 21 ]. The phase difference between voltage and current is approximately 80.9° in Figure 3(b) .…”
Section: Resultsmentioning
confidence: 99%
“…[ 22 ] Its use as a bottom electrode in PZT‐film stacks on glass substrates has had limited success, with large dielectric losses and/or deteriorated ferroelectric properties typically reported. [ 14,23,24 ] They were linked with either undesired interface layer between ITO and PZT formed upon high‐temperature annealing [ 25 ] or with non‐optimal energy‐band alignment between the two materials. [ 14,26 ]…”
Section: Introductionmentioning
confidence: 99%
“…A year later, ITO channel FETs with Bi 4− x La x Ti 3 O 12 gate insulator with maximum device mobility of 9.1 cm 2 V −1 s −1 have been reported by Miyasako and co‐workers where the ferroelectric layer is only solution‐processed and the ITO semiconductor layer is sputtered . Completely solution‐processed lead zirconium titanate (PZT) [Pb(Zr, Ti)O 3 ] gate, ITO channel FETs has been reported by Shimoda and co‐workers . Here, the FETs have been prepared on STO substrates, the gate electrode is composed of solution‐processed LaNiO 3 (LNO), followed by PZT ferroelectric layer and at the end the ITO source/drain electrodes and a semiconducting ITO layer as channel material completed the bottom‐gate architecture.…”
Section: Gating Conceptsmentioning
confidence: 82%