Fiber-to-Chip Three-Dimensional Silicon-on-Insulator Edge Couplers with High Efficiency and Tolerance

Li, Xiaoyü; Yu, Sheng‐Tao; Chen, Gui

doi:10.3390/mi14081500

Cited by 5 publications

(1 citation statement)

References 35 publications

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“…A spot size converter buried in the cladding can be composed of different polymers [48,49], with the most widely used being SU8 [50][51][52], amorphous silicon [53], and SiON materials [54,55]. In recent times, 3D-structure tapers have gained popularity, as highlighted in references [56][57][58]. Despite facing challenges such as losing Y symmetry and encountering fabrication issues, these tapers show low coupling losses.…”

Section: Vertical Multi-layer Edge Couplersmentioning

confidence: 99%

Integrated Photonic Passive Building Blocks on Silicon-on-Insulator Platform

Amanti,

Andrini,

Armani

et al. 2024

Photonics

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Integrated photonics on Silicon-On-Insulator (SOI) substrates is a well developed research field that has already significantly impacted various fields, such as quantum computing, micro sensing devices, biosensing, and high-rate communications. Although quite complex circuits can be made with such technology, everything is based on a few ’building blocks’ which are then combined to form more complex circuits. This review article provides a detailed examination of the state of the art of integrated photonic building blocks focusing on passive elements, covering fundamental principles and design methodologies. Key components discussed include waveguides, fiber-to-chip couplers, edges and gratings, phase shifters, splitters and switches (including y-branch, MMI, and directional couplers), as well as subwavelength grating structures and ring resonators. Additionally, this review addresses challenges and future prospects in advancing integrated photonic circuits on SOI platforms, focusing on scalability, power efficiency, and fabrication issues. The objective of this review is to equip researchers and engineers in the field with a comprehensive understanding of the current landscape and future trajectories of integrated photonic components on SOI substrates with a 220 nm thick device layer of intrinsic silicon.

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Section: Vertical Multi-layer Edge Couplersmentioning

confidence: 99%

Integrated Photonic Passive Building Blocks on Silicon-on-Insulator Platform

Amanti,

Andrini,

Armani

et al. 2024

Photonics

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Management of lateral misalignment loss and total insertion loss with beam waist control in high contrast single mode coupling fibers

Prabu,

Thillaigovindan,

Pandian

et al. 2024

Journal of Optical Communications

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This paper has illustrated the management of lateral misalignment loss and total insertion loss with beam waist control in high contrast single mode coupling fibers. The beam waist variations are clarified versus the fiber coupler wavelength and coupling length variations for the silica glass/fluoride glass fiber coupler with the optimum incident beam angle of 60°. Besides, the coupling loss is demonstrated against the fiber coupler wavelength and coupling length variations for the silica glass/fluoride glass fiber coupler with the optimum incident beam angle of 60°. The optimum beam waist and optimum coupling loss are deeply studied against the fiber coupler core radius variations for the silica/fluoride glass fiber coupler with the optimum incident beam angle of 60° and wavelength of 1,550 nm.

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The perfect waveguide coupler with universal impedance matching and transformation optics

Kim,

Park

2024

Nanophotonics

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Efficient energy transfer is crucial in electromagnetic communication. Therefore, producing a waveguide coupler that achieves broadband, nonreflective transmission is a challenging task. With the advancement of silicon-based integrated photonic circuits, fiber-to-chip coupling has become increasingly important. Although various couplers have been developed for fiber-to-chip coupling, they often have limitations such as long coupling length, low coupling efficiency, and narrow bandwidth. This is due to the inability to eliminate reflections between the two waveguides. Here, we introduce a method using universal impedance matching theory and transformation optics to eliminate reflections between two waveguides. The coupler, called the universal impedance matching coupler, using this method has the shortest subwavelength coupling length, a 99.9 % coupling efficiency, and a broad bandwidth.

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Fiber-to-Chip Three-Dimensional Silicon-on-Insulator Edge Couplers with High Efficiency and Tolerance

Cited by 5 publications

References 35 publications

Integrated Photonic Passive Building Blocks on Silicon-on-Insulator Platform

Integrated Photonic Passive Building Blocks on Silicon-on-Insulator Platform

Management of lateral misalignment loss and total insertion loss with beam waist control in high contrast single mode coupling fibers

The perfect waveguide coupler with universal impedance matching and transformation optics

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