Fingering instability in thin-layer electrodeposition: general trends and morphological transitions

López-Salvans, M.-Q.; Sagués, Francesc; Claret, Josep; Bassas, J.

doi:10.1016/s0022-0728(96)04829-2

Cited by 26 publications

(13 citation statements)

References 27 publications

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“…The influence of a supporting electrolyte (e.g., alkaline sulfates) on the shape of copper deposits has been widely studied in the past decade as a model system of nonequilibrium pattern formation. [16][17][18][19][20] In this case, cuprous oxide rich highly ramified deposits with high space filling capability, i.e., the so-called fingerlike aggregates, could be created by adjusting the content of alkaline sulfates and applied cathodic voltage. [16][17][18][19] The investigation on the effect of sodium sulfate (5 mM to 0.5 M) on shape evolution of our copper foam structure (data are not presented here), however, seems to suggest otherwise: there was no effect of sodium sulfate on the morphology of the foam.…”

Section: Control Of the Branch Size In The Foam Wallmentioning

confidence: 99%

Copper Foam Structures with Highly Porous Nanostructured Walls

2004

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A variety of copper foams with highly open porous walls have been successfully sculptured using the gas evolved in an electrochemical deposition process. The pore sizes and wall structures of the foams are tunable by adjusting the deposition conditions. In particular, the reduction in pore size is a result of lowering hydrophobic force of the generated hydrogen gas by adding bubble stabilizer (e.g., acetic acid) that suppresses the coalescence of bubbles, while the decrease in branch size in the foam wall is a consequence of the catalytic effect of chloride ions (added to the deposition bath) on the copper deposition reaction. For example, the size of the surface pore of a 100-µm-thick foam was reduced from 50 to about 25 µm by adding 0.1 M acetic acid to the deposition bath. With the addition of 1-50 mM HCl, the size of the copper branches was dramatically reduced; in particular, the average size of the elementary branches in the foam wall was reduced from 300 to 50 nm, forming nanostructured porous electrodes ideally suited for electrochemical and catalytic applications.

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Section: Control Of the Branch Size In The Foam Wallmentioning

confidence: 99%

Copper Foam Structures with Highly Porous Nanostructured Walls

2004

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“…By studying the electrochemical copper deposit in thingap geometries, Sagues et al [20] have suggested that the formation of Cu 2 O is a possible intermediate of copper deposition and they have shown by ex situ X-ray powder diffraction measurements the existence of Cu 2 O inclusions in copper deposits.…”

Section: Introductionmentioning

confidence: 99%

Growth of electrolytic copper dendrites. I: Current transients and optical observation

Devos

Gabrielli

Beitone³

et al. 2007

Journal of Electroanalytical Chemistry

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“…For a copper sulfate solution, the authors have shown [34,38,39] that the formation of cuprous oxide (Cu 2 O) is often responsible for the transition. As the reduction of cuprous ions into copper metal is favoured in alkaline medium, this transition can be attributed to the movement of an acidic front towards the deposit [39].…”

Section: Dendritic Growth On a Tantalum Electrodementioning

confidence: 99%