2015 16th International Conference on Electronic Packaging Technology (ICEPT) 2015
DOI: 10.1109/icept.2015.7236800
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Finite element analysis for the wire bonding process and impact force variation

Yanrui Jiang
1
,
C. U. Tan
2
,
Jian Gao
3
et al.
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Cited by 4 publications
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Die attachment, wire bonding, and encapsulation process in LED packaging: A review

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,
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Sensors and Actuators A: Physical
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Die attachment, wire bonding, and encapsulation process in LED packaging: A review

Alim
1
,
Abdullah
2
,
Aziz
3
et al. 2021
Sensors and Actuators A: Physical
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FE Modeling and Analysis on Thermosonic Flip Chip Bonding Process for Cu/low-k Wafer

Zhang
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Gao
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Chen
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et al. 2018
2018 19th International Conference on Electronic Packaging Technology (ICEPT)
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Effect of Green EMCs on Fatigue Reliability of Molded Cu Wirebond System

Lall
1
,
Deshpande
2
,
Kothari
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et al. 2018
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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