Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling

Le, Van Nhat; Benabou, Lahouari; Etgens, V. H.; Tao, Quang Bang

doi:10.1016/j.microrel.2016.07.098

Cited by 81 publications

(24 citation statements)

References 32 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Although there are several mathematical reliability prediction models for consideration of the fatigue lifetime of solder joints (Ma et al , 2015; Le et al , 2016; Chen et al , 2017; Chen et al , 2017), the power-law empirical equation has been widely reported and used (Ebeling, 2004; Samavatian, 2019). One can characterize a fatigue lifetime of the solder joint as follows: where N F is the number of cycles before failure occurs.…”

Section: Resultsmentioning

confidence: 99%

Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems

Siswanto

Borodin

Mahmoud

et al. 2021

SSMT

View full text Add to dashboard Cite

Purpose The purpose of this study is to investigate the effect of aging temperature on the barrel-type solder joint lifetime of electronic devices and to include these effects in the modified prediction model. Design/methodology/approach Several accelerated shear stress tests under different stress amplitudes and aging temperatures were performed. Findings It was found that by aging temperature increasing, the lifetime decreases. Morrow energy model was also found as the best prediction model when the aging temperature is taken into consideration. Originality value It is confirmed.

show abstract

Section: Resultsmentioning

confidence: 99%

Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems

Siswanto

Borodin

Mahmoud

et al. 2021

SSMT

View full text Add to dashboard Cite

show abstract

“…Thanks to the publicity available resources 5,[39][40][41][42][43][44][45] , we also created a huge number of input data to enrich the data resource needed to train the proposed model. It is worth-mentioning that all the collected data are extracted from the finite element model (FEM) simulation outcomes.…”

Section: Proposed Methodologymentioning

confidence: 99%

Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics

Samavatian

Fotuhi‐Firuzabad

Samavatian

et al. 2020

Sci Rep

View full text Add to dashboard Cite

The quantity and variety of parameters involved in the failure evolutions in solder joints under a thermo-mechanical process directs the reliability assessment of electronic devices to be frustratingly slow and expensive. To tackle this challenge, we develop a novel machine learning framework for reliability assessment of solder joints in electronic systems; we propose a correlation-driven neural network model that predicts the useful lifetime based on the materials properties, device configuration, and thermal cycling variations. The results indicate a high accuracy of the prediction model in the shortest possible time. A case study will evaluate the role of solder material and the joint thickness on the reliability of electronic devices; we will illustrate that the thermal cycling variations strongly determine the type of damage evolution, i.e., the creep or fatigue, during the operation. We will also demonstrate how an optimal selection of the solder thickness balances the damage types and considerably improves the useful lifetime. The established framework will set the stage for further exploration of electronic materials processing and offer a potential roadmap for new developments of such materials.

show abstract

“…Preforms, selecting specific flux amount and optimizing soldering conditions resulted in significant reduction in voiding (<10%). Le et al (2016) investigate, using the finite element method, effects of voids on the fatigue lifetime of solders of Innolot type (Sn-Ag3.7Cu0.65Bi3.0Sb1.43 Ni0.15) under IGBT power modules. The results suggest that the fatigue reliability of the solder joint depends on not only the location, the volume fraction but also the distribution of voids.…”

Section: Introductionmentioning

confidence: 99%

Low-voiding solder pastes in LED assembly

Dziurdzia

Sobolewski²,

Mikołajek³

et al. 2020

SSMT

View full text Add to dashboard Cite

Purpose This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering by using seven low-voiding lead-free solder pastes. Design/methodology/approach The solder pastes investigated are of SAC305 type, Innolot type or they are especially formulated by the manufacturers on the base of (SnAgCu) alloys with addition of some alloying elements such as Bi, In, Sb and Ti to provide low-void contents. The SnPb solder paste – OM5100 – was used as a benchmark. The solder paste coverage of LED solder pads was chosen as a measure of void contents in solder joints because of common usage of this parameter in industry practice. Findings It was found that the highest coverage and, related to it, the least void contents are in solder joints formed with the pastes LMPA-Q and REL61, which are characterized by the coverage of mean value 93.13% [standard deviation (SD) = 2.72%] and 92.93% (SD = 2.77%), respectively. The void diameters reach the mean value equal to 0.061 mm (SD = 0.044 mm) for LMPA-Q and 0.074 mm (SD = 0.052 mm) for REL61. The results are presented in the form of histograms, plot boxes and X-ray images. Some selected solder joints were observed with 3D computer tomography. Originality/value The statistical analyses are carried out on the basis of 2D X-ray images with using Origin software. They enable to compare features of various solder pastes recommended by manufacturers as low voiding. The results might be useful for solder paste manufacturers or electronic manufacturing services.

show abstract

Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling

Cited by 81 publications

References 32 publications

Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems

Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems

Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics

Low-voiding solder pastes in LED assembly

Contact Info

Product

Resources

About