2013
DOI: 10.1039/c2tc00313a
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Flaky silver powders prepared with nanofilm transition method: application for printable electronics

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Cited by 26 publications
(18 citation statements)
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References 29 publications
(21 reference statements)
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“…Silver-based materials are widely used in microelectronics owing to their excellent physico-chemical properties, good corrosion resistance, high bulk conductivity, excellent welding performance and beautiful features. [1][2][3][4][5][6] Successfully obtaining compact, smooth, and adhesive silver deposits for electronics remains an important technological goal. Ever since the rst patent described in 1840, silver deposits have usually been electrodeposited in cyanide baths, which offer the most consistent deposit quality at the lowest cost.…”
Section: Introductionmentioning
confidence: 99%
“…Silver-based materials are widely used in microelectronics owing to their excellent physico-chemical properties, good corrosion resistance, high bulk conductivity, excellent welding performance and beautiful features. [1][2][3][4][5][6] Successfully obtaining compact, smooth, and adhesive silver deposits for electronics remains an important technological goal. Ever since the rst patent described in 1840, silver deposits have usually been electrodeposited in cyanide baths, which offer the most consistent deposit quality at the lowest cost.…”
Section: Introductionmentioning
confidence: 99%
“…Aer ultrasonic treatment, the ne silver akes were separated from solution via vacuum ltration. 26,27 2.3 Preparation of solvent-free electrically conductive Ag/ EVA composites A schematic of the fabrication of the solvent-free electrically conductive Ag/EVA composites is shown in Fig. 1.…”
Section: Fabrication Of Silver Ake Powdersmentioning
confidence: 99%
“…Conductive powders can be produced from bulk materials or larger sized particles through mechanical methods, such as grinding 53 or sonicating, 54 or chemical means, such as air atomization in molten solutions. 55 In order to deposit conductive powders on substrates, powders can be compacted and extruded into a solid structure that can be abraded against the substrate to deposit the powder, as is the case with some carbon powders.…”
Section: Powdersmentioning
confidence: 99%