2012 12th International Workshop on Junction Technology 2012
DOI: 10.1109/iwjt.2012.6212811
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Flat-top flash annealing™ for advanced CMOS processing

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Cited by 7 publications
(3 citation statements)
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“…The processes of thermal treatment are an integral part of the micro-and nanoelectronics technology. A lamp-based chamber is one of the main units of the rapid treatment equipment that is widely used at present time for thermal processes including a post-implantation annealing [1] [2], diffuse doping [3] [4], crystallization of amorphous films [5] [6], contact annealing [7] [8], oxidation [9] [10] and etc. Thermal treatment processes differ in duration and radiation power from parts per million of second and peak power until 100 MW on flesh-annealing [3] [4] to tens of seconds and radiation power ~0.1 kW on low-temperature annealing [11].…”
Section: Introductionmentioning
confidence: 99%
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“…The processes of thermal treatment are an integral part of the micro-and nanoelectronics technology. A lamp-based chamber is one of the main units of the rapid treatment equipment that is widely used at present time for thermal processes including a post-implantation annealing [1] [2], diffuse doping [3] [4], crystallization of amorphous films [5] [6], contact annealing [7] [8], oxidation [9] [10] and etc. Thermal treatment processes differ in duration and radiation power from parts per million of second and peak power until 100 MW on flesh-annealing [3] [4] to tens of seconds and radiation power ~0.1 kW on low-temperature annealing [11].…”
Section: Introductionmentioning
confidence: 99%
“…The model of the thermal chamber usually used in thermal simulation includes three plates: a heater plate, a working plate (wafer) and the absorber plate [14]. The quartz window influence, as a rule, is considered by restriction of the spectral interval for the heater emission in the spectral range from 0.4 to 4.0 µm [1] [15]. However, functions of the quartz window in the thermal system Journal of Materials Science and Chemical Engineering which models the lamp-based chamber extend further.…”
Section: Introductionmentioning
confidence: 99%
“…Thermal budgets are low because of the need to prevent unnecessary phase transition, strain relaxation and defect formation as well as limit atomic diffusion (2). Alloy materials for emerging memory applications also require very low thermal budgets for TiN or other metal liner deposition.…”
Section: Introductionmentioning
confidence: 99%