Flexible Electronics Sensors for Tactile Multi-Touching

Abstract

Flexible electronics sensors for tactile applications in multi-touch sensing and large scale manufacturing were designed and fabricated. The sensors are based on polyimide substrates, with thixotropy materials used to print organic resistances and a bump on the top polyimide layer. The gap between the bottom electrode layer and the resistance layer provides a buffer distance to reduce erroneous contact during large bending. Experimental results show that the top membrane with a bump protrusion and a resistance layer had a large deflection and a quick sensitive response. The bump and resistance layer provided a concentrated von Mises stress force and inertial force on the top membrane center. When the top membrane had no bump, it had a transient response delay time and took longer to reach steady-state. For printing thick structures of flexible electronics sensors, diffusion effects and dimensional shrinkages can be improved by using a paste material with a high viscosity. Linear algorithm matrixes with Gaussian elimination and control system scanning were used for multi-touch detection. Flexible electronics sensors were printed with a resistance thickness of about 32 μm and a bump thickness of about 0.2 mm. Feasibility studies show that printing technology is appropriate for large scale manufacturing, producing sensors at a low cost.

Mutual Capacitive Flexible Tactile Sensor for 3-D Image Control

“…Many studies have claimed that their functional materials were fabricated on flexible substrates with simple picture demonstration of their flexibility with unspecified radius (r) or cyclic reliability for specific materials and not the whole sensor structure [33], [37]- [42]. Other reports have mentioned material resistance change or the characteristic changes in tactile sensors when bent [34], [43] but excluded analysis on how the sensor behaves when bent. No research discusses the sensitivity of tactile sensors influenced by mechanical force.…”

Advances and Future Challenges in Printed Batteries

“…[55] In screen printing, the ink is pressed using as queegee through as creen onto the substrate (Figure 9). It further adds simplicity,s peed, and adaptability to the fabrication process.…”

“…It further adds simplicity,s peed, and adaptability to the fabrication process. [55] In screen printing, the ink is pressed using as queegee through as creen onto the substrate (Figure 9). The screen is made of ap orous mesh.…”

Flexible Pressure Sensors Based on Screen-Printed P(VDF-TrFE) and P(VDF-TrFE)/MWCNTs

“…Further, the materials for optimum physical and electrical characteristics have already been developed [18,38,39]. It has been used to realize multilayer high-density flexible electronic circuits with embedded passive and optical devices, large area humidity and temperature sensors [16,19,40]. Screen printing is attractive for capacitive structures of P(VDFTrFE), as there are no moving tools and parts, which means there are lesser issues to deal with related to the sensor design, fabrication, interconnects and packaging [17,19,35,41].…”