2015
DOI: 10.1109/tsm.2015.2468053
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Flexible Pressure Sensors Based on Screen-Printed P(VDF-TrFE) and P(VDF-TrFE)/MWCNTs

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Cited by 72 publications
(49 citation statements)
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“…A comprehensive review of the technologies used for printed electronics and their unique properties (resolution, printing speed, layer for the fabrication of sensors and electronics) is given in [17]. The prototypes shown exemplarily in this work are fabricated using flatbed screen-printing.…”
Section: Printing Technologymentioning
confidence: 99%
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“…A comprehensive review of the technologies used for printed electronics and their unique properties (resolution, printing speed, layer for the fabrication of sensors and electronics) is given in [17]. The prototypes shown exemplarily in this work are fabricated using flatbed screen-printing.…”
Section: Printing Technologymentioning
confidence: 99%
“…Using printing techniques, sensor implementations based on [18], silver [19], PEDOT:PSS [20], and carbon nanotubes [21] have been demonstrated. In general, these strain gauges have been fabricated on polymeric substrates, e.g., polyimide [22], polyamide [20], or poly-dimethyl-siloxane (PDMS) [17]. All these sensors have in common that the strain gauge is fixed to a test device by an adhesive layer.…”
Section: Embedded Strain Gaugesmentioning
confidence: 99%
“…[8,35] Microstructures on PDMS allow it to elastically deform on application of an external force, thereby storing and releasing the energy eventually leading to the reduction of the viscoelastic creep. Besides PDMS, other polymers such as polyimide, [34] co-polymers such as P(VDF-TrFE) [36,37] has also been used as dielectric for pressure sensing applications. Other materials that have been investigated as dielectric material for flexible electronics applications include polymer composites comprising of nanofillers, high-K dielectric materials and liquid ion gels.…”
Section: Dielectricmentioning
confidence: 99%
“…Another approach for obtaining e-skin (and flexible electronics, in general) involves printing of active/passive sensing and electronics components on the flexible substrates [8,13,14]. There are numerous examples where this type of approach has been used to obtain both active and passive electronic components.…”
Section: B Printing Of Electronic and Sensing Componentsmentioning
confidence: 99%