Flexural plate wave resonator excited with Lorentz forces

Martin, Stephen J.; Butler, M. A.; Spates, J.J.; Mitchell, M. A.; Schubert, William K.

doi:10.1063/1.367242

Cited by 32 publications

(18 citation statements)

References 3 publications

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“…There are many articles describing transducers for the measurement of density and viscosity fabricated by the methods of MEMS in the archival literature, and here we give four examples. Andrews and Harris [13] have described a device with two parallel plates, each supported by beams, that are oscillated normal to each other to determine the viscosity of gases while Martin et al [14] presented a flexural plate wave resonator, fabricated on a silicon nitride membrane, to determine density. There are also fluid-filled vibrating U-tube densimeters fabricated with MEMS albeit with a square rather than the traditional circular cross section [15][16][17].…”

Section: Introductionmentioning

confidence: 99%

A Vibrating Plate Fabricated by the Methods of Microelectromechanical Systems (MEMS) for the Simultaneous Measurement of Density and Viscosity: Results for Argon at Temperatures Between 323 and 423K at Pressures up to 68 MPa

et al. 2006

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In the petroleum industry, measurements of the density and viscosity of petroleum reservoir fluids are required to determine the value of the produced fluid and the production strategy. Measurements of the density and viscosity of petroleum fluids require a transducer that can operate at reservoir conditions, and results with an uncertainty of about ±1% in density and ±10% in viscosity are needed to guide value and exploitation calculations with sufficient rigor. Necessarily, these specifications place robustness as a superior priority to accuracy for the design. A vibrating plate, with dimensions of the order of 1 mm and a mass of about 0.12 mg, clamped along one edge, has been fabricated, with the methods of Microelectromechanical (MEMS) technology, to provide measurements of both density and viscosity of fluids in which it is immersed. The resonance frequency (at pressure p = 0 is about 12 kHz) and quality factor (at p = 0 is about 2 800) of the first order bending (flexural) mode of the plate are combined with semi-empirical working equations, coefficients obtained by calibration, and the mechanical properties of the plate to provide the density and viscosity of the fluid into which it is immersed. When the device was surrounded by argon at temperatures between 348 and 423 K and at pressures between 20 and 68 MPa, the density and viscosity were determined with an expanded (k = 2) uncertainty, including the calibration, of about ±0.35% and ±3%, respectively. These results, when compared with accepted correlations for argon reported in the literature, were found to lie within ±0.8% for density and less than ±5% for viscosity of literature values, which are within a reasonable multiple of the relative combined expanded (k = 2) uncertainty.

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Section: Introductionmentioning

confidence: 99%

A Vibrating Plate Fabricated by the Methods of Microelectromechanical Systems (MEMS) for the Simultaneous Measurement of Density and Viscosity: Results for Argon at Temperatures Between 323 and 423K at Pressures up to 68 MPa

et al. 2006

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“…Because the damping is so low during vacuum operation of these devices they are also easily overdriven, which causes amplitude-dependent stiffening and an accompanying increase in the resonant frequency 6 . This behavior is shown in Fig.…”

Section: Fundamental Mode Resonatorsmentioning

confidence: 99%

“…(13) and (8)]. In the calculation we use the D, T o , and ρ s values determined for the particular device 6 , along with the membrane dimensions. The calculated response, in qualitative agreement with the measured response, shows that the fundamental transverse mode (m,1) is most strongly excited; odd-order transverse modes (m,n) are excited at successively higher frequencies, but with diminishing amplitudes.…”

Section: ) 11mentioning

confidence: 99%

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Development of Magnetically Excited Flexural Plate Wave Devices for Implementation as Physical, Chemical, and Acoustic Sensors, and as Integrated Micro-Pumps for Sensored Systems

Schubert¹,

Mitchell²,

Graf³

et al. 2002

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The magnetically excited flexural plate wave (mag-FPW) device has great promise as a versatile sensor platform. FPW's can have better sensitivity at lower operating frequencies than surface acoustic wave (SAW) devices. Lower operating frequency (< 1 MHz for the FPW versus several hundred MHz to a few GHz for the SAW device) simplifies the control electronics and makes integration of sensor with electronics easier. Magnetic rather than piezoelectric excitation of the FPW greatly simplifies the device structure and processing by eliminating the need for piezoelectric thin films, also simplifying integration issues. The versatile mag-FPW resonator structure can potentially be configured to fulfill a number of critical functions in an autonomous sensored system. As a physical sensor, the device can be extremely sensitive to temperature, fluid flow, strain, acceleration and vibration. By coating the membrane with self-assembled monolayers (SAMs), or polymer films with selective absorption properties (originally developed for SAW sensors), the mass sensitivity of the FPW allows it to be used as biological or chemical sensors. Yet another critical need in autonomous sensor systems is the ability to pump fluid. FPW structures can be configured as micro-pumps. This report describes work done to develop mag-FPW devices as physical, chemical, and acoustic sensors, and as micro-pumps for both liquid and gas-phase analytes to enable new integrated sensing platform.4

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“…Lorentz force excitation eliminates many of the processing and integration difficulties associated with the piezoelectric thin film materials. 16 The operation of the mag-FPW resonator has been described in detail in Reference 16 and is illustrated in Figure 29. The device is formed by (1) depositing a low-stress silicon-nitride (SiN) layer on both sides of a <100> silicon substrate, (2) patterning a square or rectangular opening in the backside SiN layer, (3) patterning a meander-line current conductor on the front surface SiN layer (centered with respect to the rectangular opening on the backside), and (4) performing an anisotropic silicon etch to remove the silicon below the membrane.…”

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confidence: 99%

Post-Processed Integrated Microsystems

Shul¹,

Kravitz²,

Christenson³

et al. 2001

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This report represents the completion of a three-year Laboratory-Directed Research and Development (LDRD) program to develop a low cost platform for integrated microsystems that is easily configured to meet a wide variety of specific applications-driven needs. Once developed, this platform, which incorporates many of the elements that are common to numerous microsystems, will enable integrated microsystem users access to this technology without paying the high up-front development costs that are now required. The process starts with the fabrication, or acquisition, of wafers which have sparsely placed device or circuit components fabricated in any foundried technology (Si CMOS or bipolar technologies, high-frequency GaAs technologies, MEMS, etc.). We call these "smart substrates." Using the diverse processing capabilities of SNL, we then intend to "post-process" high-value components in open areas on the front or back of the wafers and microelectronically integrate the added components with the pre-placed circuitry. Examples of post-processed components include sensors, antennas, SAW devices, passive elements, micro-optics, and surface-mounted hybrids. The combination of preplaced electronics and post-processed components will enable the development of many new types of integrated microsystems. Targeted applications include integrated sensor systems, tags, and electromechanical systems. INTRODUCTIONAdvanced optoelectromechanical system design is constantly pushing for higher levels of functionality and reliability with lower system size, weight, power, and cost. To achieve these goals, many system designs are envisioned as fully integrated "microsystems-on-a-chip". This level of integration is often hard to realize because of the necessity of combining different devices made with diverse materials and processes, all in a single microelectronic technology (i.e., silicon CMOS).Here we propose a simpler, faster, and more cost-effective approach to integrated microsystem design that addresses many of these problems. The process starts with the fabrication, or acquisition, of wafers with sparsely placed device or circuit components fabricated in any foundried technology (Si CMOS or bipolar technologies, high-frequency GaAs technologies, MEMS, etc.). We call these "smart substrates". Using the diverse processing capabilities of SNL, we then intend to "post-process" (i.e., to interrupt a microelectronic production sequence in mid stream and do something unique) high-value components in open areas on the front or back of the wafers and microelectronically integrate the added components with the pre-placed circuitry. Examples of post-processed components include sensors, antennas, SAW devices, LIGA-formed components, passive elements, micro-optics, and surface-mounted hybrids. The combination of pre-placed electronics and post-processed components will enable the development of many new types of integrated microsystems. Targeted applications include integrated sensors and control electronics, electromechanical s...

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Flexural plate wave resonator excited with Lorentz forces

Cited by 32 publications

References 3 publications

A Vibrating Plate Fabricated by the Methods of Microelectromechanical Systems (MEMS) for the Simultaneous Measurement of Density and Viscosity: Results for Argon at Temperatures Between 323 and 423K at Pressures up to 68 MPa

A Vibrating Plate Fabricated by the Methods of Microelectromechanical Systems (MEMS) for the Simultaneous Measurement of Density and Viscosity: Results for Argon at Temperatures Between 323 and 423K at Pressures up to 68 MPa

Development of Magnetically Excited Flexural Plate Wave Devices for Implementation as Physical, Chemical, and Acoustic Sensors, and as Integrated Micro-Pumps for Sensored Systems

Post-Processed Integrated Microsystems

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