Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models

Abstract

This study investigates the effects of employing different two-dimensional (2-D) and three-dimensional (3-D) finite element analysis (FEA) models for analyzing the solder joint reliability performance of a flip chip on board assembly. The FEA models investigated were the 2-D-plane strain, 2-D-plane stress, 3-D-1/8th symmetry and 3-D-strip models. The different stress and strain responses generated by the four different FEA models were applied to various solder joint low cycle fatigue life prediction relationships. The investigation shows that the 2-D-plane strain and 2-D-plane stress models gave the highest and lowest solder joint strains, respectively. The 3-D-strip and 3-D-1/8th symmetry model results fall in between the 2-D-plane strain and 2-D-plane stress model results. The 3-D-1/8th symmetry model agrees better with the 2-D-plane strain model, while the 3-D-strip model agrees better with the 2-D-plane stress model results. The results for the fatigue life prediction analyses also show similar trends.

Solder joint reliability in flip chip package with surface treatment of ENIG under thermal shock test

“…Therefore, these results could well explain the experimental results that showed crack initiation and growth through the region near IMC layers of the corner solder bump. It should be also noted that the plastic work values were higher than those of previous research [15,16]. Figure 6 shows the distributions of the plastic work after the simulation of three thermal shocks.…”

Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages

“…3 displays the temperature profile. Both the dwell time and the ramp time were 300 s. The effect of stress-free temperature in FEM simulation has been discussed in the past study [35]. It shows that the residual stress due to bonding assembly at high temperature could play an important role in the stress/strain analysis.…”

Thermo-mechanical reliability optimization of MEMS-based quartz resonator using validated finite element model

“…The finite element method has been widely used in the thermal mechanical analysis area. Many research papers [5,6] have been published on the topic of 3D finite element analysis of MEMS devices on thermal mechanical reliability. However, the modeling of practical miniature resonators still requires further investigation.…”