Fluidic Interconnects in Integrated Liquid Cooling Systems for 3-D Stacked TSV Modules

Yue, Tang Gong; Pin, Tan Siow; Khan, N.; Pinjala, D.; Lau, John H.; Bin, Yu; Kripesh, V.; Chuan, Toh Kok

doi:10.1109/eptc.2008.4763491

Cited by 5 publications

(1 citation statement)

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“…Research by Yue et al (2008), Kearney (2009) and Kearney et al (2009) identified first order integrated liquid cooling solutions with a pump in series or directly integrated on the electronic substrate-reducing power consumption and improving thermal performance. These preliminary studies highlight the importance of a pump in situ with the cooling network to further facilitate the advancement of full scale on chip integration.…”

Section: Introductionmentioning

confidence: 99%

A numerical hydrodynamic and thermal characterization of an inter-strata liquid cooling solution for 3D ICs

2011

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A novel integrated thermal management solution is proposed to alleviate hot spots in a contemporary 3D IC architecture. The solution employs a series of integrated microchannels, interconnected through each stratum by through silicon fluidic vias (TSFVs), and permits the transfer of heat, via a coolant, from hot to cold zones. This microfluidic system is driven by an integrated AC electrokinetic pump embedded in the channel walls. Recent advancements in electrokinetic micropump technology have allowed greater increases in fluid velocity (mm/s) while operating within the voltage constraints of a 3D IC. This paper presents a 2D simulation of an electrokinetic micropump operating at V pp = 1.5 V in a 40 lm channel and examines its velocity profile for six frequencies in the range 100 B x B 100 MHz. An optimum frequency of 100 kHz was established within this range and this was further examined with a constant heat flux of 186 W/cm 2 imposed on the wall for an inlet fluid temperature of 40°C. Temperature profiles are presented at the channel-silicon interface and compared with theory.

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Section: Introductionmentioning

confidence: 99%