Fluorinated bismaleimide resin with good processability, high toughness, and outstanding dielectric properties

Abstract

In this study, novel fluorinated bismaleimide (BMI) resins were prepared by the copolymerization of 2,2 0 -bis[4-(4-maleimidephenoxy)phenyl]hexafluoropropane (6FBMP) and diallyl hexafluorobisphenol A (6FDABPA) to enhance their dielectric properties. The dielectric properties of the resins were investigated in the frequency range 7-18 GHz through a cavity method. Through the incorporation of a hexafluoroisopropyl group with the polymer chain, the dielectric constant (e) was effectively decreased because of the small dipole and the low polarizability of the carbon-fluorine (CAF) bonds. The 6FBMP/6FDABPA resin possessed excellent dielectric properties, with e being 2.88 and the dielectric loss being 0.009 at 10 GHz and 258C. In comparison with the 4,4 0 -bismaleimidodiphenylmethane (BDM)/2,2 0 -diallyl bisphenol A (DABPA) resin, the glass-transition temperature (T g ) of 6FBMP/6FDABPA decreased. The flexible ether group in the long chain of 6FBMP was considered to disrupt chain packing and cause a decreased crosslinking density and a lower T g . 6FBMP/6FDABPA showed a similar thermal decomposition temperature and good thermal properties like the BDM/DABPA resin, whereas the impact strength of the 6FBMP/6FDABPA resin was almost 1.6 times higher than that of the BDM/DABPA resin.

Highly Heat-Resistant Poly(bismaleimide-co-styrene) Microspheres Bearing Maleimide Functional Groups by Self-Stabilized Precipitation Polymerization

“…Cyanate esters have been widely utilized in the field of electronics and microwave communication materials due to their distinctive characteristics such as excellent mechanical properties, high thermal stability, and easy processing. , Besides, cyanate esters possess the advantage of no small molecules released during the curing process . The blends of bismaleimide and cyanate esters are usually used as matrix resins for high-performance composite materials, commonly known as BT resins, which have been widely applied in printed circuit boards, high-frequency circuits, and wave-transparent materials. ,, To combine the advantages of both cyanate esters and BMI resins, we utilized poly­(BMIP -co- St) microspheres to blend with cyanate resins. The blends were cured at high temperatures, and the cross-linked networks were formed through the reaction between the residual maleimide groups of poly­(BMIP -co- St) and cyanate groups.…”

“…42 The blends of bismaleimide and cyanate esters are usually used as matrix resins for high-performance composite materials, commonly known as BT resins, which have been widely applied in printed circuit boards, high-frequency circuits, and wave-transparent materials. 29,43,44 To combine the advantages of both cyanate esters and BMI resins, we utilized poly(BMIP-co-St) microspheres to blend with cyanate resins. The blends were cured at high temperatures, and the cross-linked networks were formed through the reaction between the residual maleimide groups of poly(BMIP-co-St) and cyanate groups.…”

Phthalonitrile-Terminated Silicon-Containing Oligomers: Synthesis, Polymerization, and Properties

“…However, the dielectric performance at high frequencies was seldom reported, which was of vital importance to the high-frequency wave-transmitting materials and the printed-circuit boards for denser and faster microelectronic circuits. 44 The dielectric properties of BPSiPEN/ quartz fiber laminates cured to 375 °C were recorded from 7 to 19 GHz and are presented in Figure 12. The dielectric constant and loss were stable and noticeably low at gigahertz frequencies.…”

Cure kinetics of bismaleimides as basis for polyimide‐like inks for PolyJet™‐3D‐printing

“…The rheological properties of BMI‐based materials can be tuned by tailoring the molecular weights of the oligomers . Typical properties associated with cured BMI‐based systems include high glass‐transition temperatures (230–380 °C), good hot‐wet performance, excellent electrical properties, and low flammability . The BMI‐materials used in this study have very flexible backbones, resulting in low shrinkage during curing and yielding polymers that show high thermal stability (decomposition temperature typically >400 °C).…”