Fluorocarbon film-assisted fabrication of a CoNi mold with high aspect ratio for nanoimprint lithography

Rizwan, Muhammad; Cho, Si-Hyeong; Lee, Jung-Hwan; Park, Jin-Goo

doi:10.1016/j.mee.2012.11.006

Cited by 9 publications

(3 citation statements)

References 15 publications

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“…They found that HAR pillars had the best ability to increase the light extraction efficiency of LEDs. Because Si stamp has a short lifetime, Park et al fabricated a CoNi mold with HAR structures [ 9 ], which was then applied to a 20 nm fluorocarbon antistiction layer. Hirai et al proposed double-layer resist nanoimprinting to fabricate HAR structures under low-pressure conditions [ 10 ].…”

Section: Introductionmentioning

confidence: 99%

High Aspect Ratio Nanoimprint Mold-Cavity Filling and Stress Simulation Based on Finite-Element Analysis

2017

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High aspect ratio three-dimensional micro- and nanopatterns have important applications in diverse fields. However, fabricating these structures by a nanoimprinting method invites problems like collapse, dislocation, and defects. Finite-element analysis (FEA) is a good approach to help understand the filling process and stress distribution. The FEA method was employed to simulate the nanoimprinting process using positive and negative molds with aspect ratios of 1:1, 3:1, 5:1, and 7:1. During the filling process, the resist adjacent to boundaries has the maximum displacement. The corners of contact areas between the protruding part of the mold and the resist has the maximum Von Mises stress. For both positive and negative molds, the maximum stress in the mold increases with aspect ratio. However, filling up negative molds is more difficult than positive ones. With the same aspect ratio, the maximum stress in a negative mold is approximately twice as large as that in a positive one.

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Section: Introductionmentioning

confidence: 99%

High Aspect Ratio Nanoimprint Mold-Cavity Filling and Stress Simulation Based on Finite-Element Analysis

2017

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“…For a constant metal layer thickness, the maximum stress at the top centre of the metal layer increases as the aspect ratio decreases from 2.0 to 0.5. Previous studies reported that the stress was lowered by decreasing the aspect ratio in nanoimprinting, but only for polymers without a metal layer 19 . In the demoulding of a metal/polymer bilayer grating, there is a negative correlation between the maximum stress at the top centre of the metal layer and the aspect ratio.…”

Section: Resultsmentioning

confidence: 95%

Effects of aspect ratio and metal layer thickness on demoulding of metal/polymer bilayer gratings during nanoimprinting

Zheng

Wang

Zhang

et al. 2018

Sci Rep

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During the fabrication of metal/polymer bilayer gratings by nanoimprint lithography, adhesion and friction forces at the interfaces can deform and damage the transferred pattern of the bilayer grating during the demoulding process. To improve the quality of bilayer gratings, the effects of the aspect ratio and metal layer thickness on deformation and stress during the demoulding process in the nanoimprinting of bilayer gratings were investigated. This information was used to determine the optimal grating parameters. The results for the von Mises stress and deformation of bilayer gratings are discussed in detail. The effects of the aspect ratio and metal layer thickness on the grating quality are then considered.

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“…the nickel layer is approximately more than 50 µm, which is stiff enough to sustain the inner stress bending, current density can be increased to 5 A/dm 2 . This electroplating ways has also been applied in [82,83] to successfully electroplate a cross bar (24 µm in depth and 30 µm in width) and various nanostructure patterns (2 µm in height). For some ultra-small structures, e.g., less than 1µm, the current density should be even less.…”

Section: The Current Densitymentioning

confidence: 99%

Tools for ultrasonic hot embossing

et al. 2014

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Fluorocarbon film-assisted fabrication of a CoNi mold with high aspect ratio for nanoimprint lithography

Cited by 9 publications

References 15 publications

High Aspect Ratio Nanoimprint Mold-Cavity Filling and Stress Simulation Based on Finite-Element Analysis

High Aspect Ratio Nanoimprint Mold-Cavity Filling and Stress Simulation Based on Finite-Element Analysis

Effects of aspect ratio and metal layer thickness on demoulding of metal/polymer bilayer gratings during nanoimprinting

Tools for ultrasonic hot embossing

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