The integration of
III–V materials on photonic integrated
circuits has enjoyed a lot of attention because of the necessity of
merging photon sources with silicon electronics. Nevertheless, III–V
source integration technologies are not sufficiently mature, inhibiting
the employment of such platforms to a broader range of applications.
Here, we present a novel approach that enables the transfer of III–V
nanolayers (≈250 nm) to silicates via oxide bonding. Through
use of a thick photoresist scaffold (≈30 μm), complete
removal of the substrate can be performed while preserving the relative
structure morphology. The use of the III–V native oxide without
depositing interfacial oxide layers greatly reduces the processing
time and cost. The transfer of an array composed of 1 mm long InGaP
waveguides with 250 nm thickness and widths spanning from 0.7 to 11.2
μm to a SiO2 substrate has been experimentally demonstrated,
evidencing the feasibility of the technique for wafer-scale processing.
The application of the nanolayered waveguides in the spontaneous-parametric
down-conversion process has been tested by photon-correlation measurement,
showing good agreement with the theoretical model.