2000
DOI: 10.1063/1.372260
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Formation and characteristics of silicon nanocrystals in plasma-enhanced chemical-vapor-deposited silicon-rich oxide

Abstract: Articles you may be interested inMethods of producing plasma enhanced chemical vapor deposition silicon nitride thin films with high compressive and tensile stress J. Vac. Sci. Technol. A 26, 517 (2008); 10.1116/1.2906259 Silicon nanocrystal formation in annealed silicon-rich silicon oxide films prepared by plasma enhanced chemical vapor deposition A comparative study on inductively-coupled plasma high-density plasma, plasma-enhanced, and low pressure chemical vapor deposition silicon nitride filmsThe forma… Show more

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Cited by 51 publications
(16 citation statements)
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“…9 -11,13 The formation of Si nanocrystals embedded in SiO 2 was claimed when the substrate temperatures during deposition exceeded 400°C. 9,10,13 However, deposition of co-sputtered Si and SiO 2 without intentional heating of the substrates does not lead to the appearance of nanocrystals in the as-prepared layers. 11 One can conclude that crystallization is provided by a combination of thermal and ion-induced processes.…”
Section: Discussionmentioning
confidence: 98%
“…9 -11,13 The formation of Si nanocrystals embedded in SiO 2 was claimed when the substrate temperatures during deposition exceeded 400°C. 9,10,13 However, deposition of co-sputtered Si and SiO 2 without intentional heating of the substrates does not lead to the appearance of nanocrystals in the as-prepared layers. 11 One can conclude that crystallization is provided by a combination of thermal and ion-induced processes.…”
Section: Discussionmentioning
confidence: 98%
“…The silicon nanocrystals can be produced by annealing silicon oxide supersaturated with excess silicon atoms, either introduced during growth by sputtering [13,14], chemical vapor deposition [15,16], laser ablation [17], or by ion implantation [18,19]. The latter method is routinely used in silicon integrated circuit technology and offers a number of advantages such as high controllability of dopant concentration and spatial distribution, as well as the possibility of extending elemental clusters forming compounds using sequential implantation of different ions.…”
Section: Introductionmentioning
confidence: 99%
“…Today, there are a lot of methods for obtaining silicon nanocrystals, namely Stober, pulsed laser, controlled precipitation, emulsions, oxidation, silane combustion, gas evaporation, cosputtering and thermic degradation [37][38][39][40][41][42][43][44][45][46][47][48], chemical vapor deposition (CVD) [49,50], low pressure chemical vapor deposition (LPCVD) [51], ionic implantation [52,53] and other ones. Unfortunately, such methods are very expensive.…”
Section: Introductionmentioning
confidence: 99%