2011
DOI: 10.1016/j.tsf.2011.02.060
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Formation and photoluminescence of Si nanocrystals in controlled multilayer structure comprising of Si-rich nitride and ultrathin silicon nitride barrier layers

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Cited by 44 publications
(40 citation statements)
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“…Under PE-CVD conditions, high quality SiN x films with minimal hydrogen content can be obtained in the temperature range of 300-400 • C. This temperature range is also needed to yield higher density films with low porosity and surface roughness, since it allows longer surface diffusion length of adsorbed radicals in comparison to when lower substrate temperatures are applied. 31 Significantly lower substrate temperature (<100…”
Section: Chemical Vapor Deposition (Cvd)mentioning
confidence: 99%
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“…Under PE-CVD conditions, high quality SiN x films with minimal hydrogen content can be obtained in the temperature range of 300-400 • C. This temperature range is also needed to yield higher density films with low porosity and surface roughness, since it allows longer surface diffusion length of adsorbed radicals in comparison to when lower substrate temperatures are applied. 31 Significantly lower substrate temperature (<100…”
Section: Chemical Vapor Deposition (Cvd)mentioning
confidence: 99%
“…Most common applications for sputtered SiN x films consist primarily of a barrier/passivation coating and etch stop in microelectromechanical systems (MEMS); 74,116 high refractive index material for solar cells, 25 through-Si vias for three-dimensional (3D) semiconductor devices, electroluminescent devices, and display devices; 25,31 and high κ dielectric layer in stacked high-dielectric constant (κ) structures for non-volatile memory (NVM) devices. 75 A unique application is as a host material for Si nanocrystals as active light emitters for uses in PL and optoelectronic devices.…”
Section: Physical Vapor Deposition (Pvd)mentioning
confidence: 99%
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