“…However, the application of CCP is more profound to the planar MOSFET [3,7] with substrate contact since CCP setup needs the four electrical contacts to the gate, drain, source, and substrate where it measures the I CP from the substrate [1][2][3]7,8]. Therefore, a practical three-terminal charge pumping (3T-CP) technique presented by Passmore et al [3,7] for vertical transistor structures is found to be suitable for trench DMOS with the absence of substrate contact.…”