Frequency Domain Based Measurement Method for the Thermal Parameters of a Thin-film Diaphragm Embedded in a MEMS Multi-parameter Wind Sensor

Beigelbeck, Roman; Romero, Diego; Ćerimović, Samir; Köhl, F.; Voglhuber-Brunnmaier, Thomas; Jakoby, Bernhard; Urban, G.

doi:10.1016/j.proeng.2014.11.568

Cited by 2 publications

(1 citation statement)

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In order to circumvent difficulties attributed to custom specimen fabrication, we recently developed two novel methods to extract the thermal thin-film parameters directly from measurements carried out on the wind sensor device. The first method is based on frequency-response measurements of the excess temperature by the thin-film thermistors and has been reported in [5]. The second technique relies on the determination of the transient response of the excess temperature at the thermistors sites and will be addressed in this contribution.…”

Section: Introductionmentioning

confidence: 99%

Transient measurement method for the thermal properties of the thin-film membrane in a multi-parameter wind sensor

Beigelbeck

Ćerimović

Köhl

et al. 2014

IEEE SENSORS 2014 Proceedings

Self Cite

View full text Add to dashboard Cite

The performance of our previously devised thermal multi-parameter wind sensor for gaseous fluids is noticeably influenced by the thermal heat shunt induced by the thin-film membrane where heating and temperature sensing elements are embedded. Consequently, reliable values for the thermal parameters of the thin-film membrane are mandatory for their design and characterization. We present a new method to determine the thermal conductivity, thermal diffusivity, and average spectral emissivity of the thin-film membrane. Compared to commonly used measurement techniques for these thermal thin-film parameters, our method does not require custom-built specimens, i. e., the results can be obtained from transient excess temperature measurements carried out directly on the wind sensor device. We describe the theoretical background of this method, provide an efficient analytical model for the data evaluation including its validation by computer numerical analyses, and showcase sample measurements on multi-layer Si x N y -SiO 2 thin films.

show abstract

Section: Introductionmentioning

confidence: 99%