“…In addition, various issues like bonding strength, interfacial stress, microchannel fidelity, solvent compatibility, surface chemistry, and optical properties of the bonded microfluidic chips should all be taken into account for the selection of appropriate bonding methods. So far, a variety of bonding technologies have been developed to seal PDMS-based microfluidic chips, such as thermal bonding [ 22 ], solvent bonding [ 23 ], plasma-aided bonding [ 24 , 25 , 26 ], adhesive bonding [ 27 , 28 ], and ultrasonic welding [ 29 , 30 ]. However, the limitations of either fabrication size or materials selectivity are obvious for these methodologies.…”