Further developments in gold-stud bump bonding

Abstract

As silicon detectors in high energy physics experiments require increasingly complex assembly procedures, the availability of a wide variety of interconnect technologies provides more options for overcoming obstacles in generic R&D. Gold ball bonding has been a staple in the interconnect industry due to its ease of use and reliability. However, due to some limitations in the standard technique, alternate methods of gold-stud bonding are being developed. This paper presents recent progress and challenges faced in the development of double gold-stud bonding and 0.5 mil wire gold-stud bonding at the UC Davis Facility for Interconnect Technology. Advantages and limitations of each technique are analyzed to provide insight into potential applications for each method. Optimization of procedures and parameters is also presented.

The International Linear Collider Technical Design Report - Volume 4: Detectors

“…There are, however, some key elements where novel solutions are required. The sensors, like those for the ECAL, employ a double-metal layer to route signals to bump-bonding arrays for readout by the KPiX ASIC [87,88,89]. As with the ECAL, traces on the second metal layer of the sensor connect power and signal lines on the KPiX chip to a readout cable that is also bump bonded to the face of the sensor.…”

Experimental parametric study on the bumping and coining of gold studs for flip chip bonding

“…Based on prior research by other parties, 36 N (80 g/stud) was chosen as the bump coining force and 45 N (100 g/stud) was chosen as the chip bonding force [5][6][7][8].…”

Height Uniformity Simulation and Experimental Study of Electroplating Gold Bump for 2.5D/3D Integrated Packaging

“…The most common fabrication approaches for Au bump are the stud method and the electroplating method [42,43]. Electroplating Au bump was seen as an effective way to assemble high power density devices with simple operation and controllable size.…”