2004
DOI: 10.1016/j.sse.2003.09.016
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Gate capacitance characteristics of a poly-Si thin film transistor

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Cited by 5 publications
(2 citation statements)
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“…Moreover, there are a large number of Si-H bonds at the grain boundary of channel layer, and hence, after stressed, traps will be produced. The C GD − V G curve, which was reported in several literatures, [3][4][5] was adopted instead of I-V curves to analyze the characteristic of CGLC n-TFT after dc voltage stressed. The stress voltage was gate voltage was equal to drain voltage and can be referred to some lectures.…”
Section: Gate-to-drain Capacitance Verifying the Continuous-wave Greementioning
confidence: 99%
“…Moreover, there are a large number of Si-H bonds at the grain boundary of channel layer, and hence, after stressed, traps will be produced. The C GD − V G curve, which was reported in several literatures, [3][4][5] was adopted instead of I-V curves to analyze the characteristic of CGLC n-TFT after dc voltage stressed. The stress voltage was gate voltage was equal to drain voltage and can be referred to some lectures.…”
Section: Gate-to-drain Capacitance Verifying the Continuous-wave Greementioning
confidence: 99%
“…A successful design of circuits using poly-Si TFTs requires a proper understanding of its electrical properties. Several models (physics based, empirical and analytical) have been proposed to predict the characteristics of poly-Si TFTs [11][12][13][14][15][16][17][18][19][20][21] but these do not give insight into the device behavior due to the effects of traps and grain-boundaries. Thus, the need arises to formulate a model that gives insight into the effects of traps and grain-boundaries.…”
Section: Introductionmentioning
confidence: 99%