A new concept aims at the development of genetically intelligent ("gentelligent TM ") devices, which bequeath production or application data to their next generation. To support such an approach, it is necessary to gather various data from the device. To do so, a family of modular sensors is under development, which is capable of measuring strain, force, magnetic properties, and temperature. Such micro sensors consist of structural and functional patterned thin films. A technology particularly well suited for such thin films is the vacuum deposition. This process allows to deposit rather different materials for conductors, insulators, and alloys for creating functional films. This work describes the technology development for fabricating temperature sensitive metallic functional films of Cu and Pt by means of electron beam evaporation and of an insulating SiO 2 film by means of thermal evaporation. The latter film is deposited by evaporating SiO and its thermal oxidation to SiO 2 .