Grain boundary creep in copper

Ayensu, A.; Quainoo, G. K.; Adjepong, S. K.

doi:10.1007/bf00420200

Cited by 6 publications

(8 citation statements)

References 4 publications

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“…This is of course somewhat crude, but since the creep of copper has been the object of numerous studies focused on the steady-state creep regime (e.g., Refs. 64,65,[103][104][105][106][107][108][109][110][111][112][113][114][115][116][117][118][119], and since this simple view of the ITE phenomenon illustrates well both its origin and its intrinsic dependence on several parameters, we adopt it here.…”

Section: The Ductility Trough Of Unalloyed Coppermentioning

confidence: 99%

Intermediate temperature embrittlement of copper alloys

Laporte¹,

Mortensen²

2009

International Materials Reviews

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Copper and its alloys generally display a severe reduction in ductility between roughly 300°C and 600°C, a phenomenon variously called "intermediate temperature embrittlement" or "ductility trough behaviour". This review of the phenomenon begins by placing it in the wider context of the high-temperature fracture of metals, showing how its occurrence can be rationalized in simple terms on the basis of what is known of intergranular creep fracture and dynamic recrystallisation. Data in the literature are reviewed to identify main causes and mechanisms for embrittlement, first for pure copper, and then for monophase and multiphase copper alloys. Coverage then turns to the "grain boundary embrittlement" phenomenon, caused by the intergranular segregation of even minute quantities of alloying additions or impurities, which appears to worsen dramatically the intermediate temperature embrittlement of copper alloys. Finally, metal-induced embrittlement, including in particular liquid metal embrittlement, is presented as a second mechanism leading to an exacerbation of the intermediate temperature embrittlement of copper and its alloys.

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Section: The Ductility Trough Of Unalloyed Coppermentioning

confidence: 99%

Intermediate temperature embrittlement of copper alloys

Laporte¹,

Mortensen²

2009

International Materials Reviews

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“…Creep can be determined by long-term laboratory creep tests, the results of which are used to generate creep curves. A creep behavior drop in pure copper and some copper alloys at high temperature has been reported by many researchers [4][5][6][7][8]. There are three basic mechanisms that can contribute to creep in metals, namely ; Dislocation slip and climb, Grain boundary sliding, and Diffusional flow.…”

Section: Introductionmentioning

confidence: 99%

“…There are three basic mechanisms that can contribute to creep in metals, namely ; Dislocation slip and climb, Grain boundary sliding, and Diffusional flow. For example, Ayensu et al [4] have been studied creep mechanism of copper wires. They have been found that the creep mechanism is governed by grain boundary sliding.…”

Section: Introductionmentioning

confidence: 99%

Heat Treatment Effect on the Creep of Industrial Copper Wire

Gareh

Boumerzoug

2016

Acta Metall Slovaca

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Creep behavior of copper wire, produced by wiredrawing process in ENICAB Biskra, has been investigated by creep tests at 340°C under the stress 98,108 and 118 MPa. In this investigation, three samples have been tested: copper drawn wire non heat treated, and heat treated at 600°C and 700°C. Microstructure after the creep test was observed by optical microscopy to understand the rupture mechanism. We have found that the sample heat treated at 600 °C had a longer creep life. We have also deduced that the dislocation creep was the creep deformation mechanism of the drawn copper. SEM observations of fractured surfaces after creep tests of drawn copper wire non heat treated and treated 10 min at 600 ° C under stress of 118 MPa.

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“…Consequently, it is important to characterize its creep and creep behaviors because this material requires adequate creep resistance to ensure reliable performance in service. We note that there were creep tests carried out on high purity copper wires [8][9][10][11][12][13][14][15][16]. However, some limited scientific works have been concerned on creep behavior of drawn copper [15,16].…”

Section: Introductionmentioning

confidence: 99%

Effect of Prior-Heat Treatments on the Creep Behavior of an Industrial Drawn Copper

Boumerzoug¹,

Gareh²,

Beribeche³

2012

WJCMP

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The effect of prior-heat treatments at 500℃, 600℃ and 700℃ on the creep behavior of an industrial drawn copper has been studied under constant stresses (98, 108 and 118 MPa) and temperatures (290℃ and 340℃). The results revealed that the creep behavior and the creep life of the material depend strongly on these prior-heat treatments. The apparent activation energy Qc for different creep tests of a drawn copper wire was calculated. The fracture mechanism of the material is characterized using optical microscopy

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Grain boundary creep in copper

Cited by 6 publications

References 4 publications

Intermediate temperature embrittlement of copper alloys

Intermediate temperature embrittlement of copper alloys

Heat Treatment Effect on the Creep of Industrial Copper Wire

Effect of Prior-Heat Treatments on the Creep Behavior of an Industrial Drawn Copper

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