Grain boundary diffusion and segregation of Ni in Cu

Divinski, Sergiy V.; Ribbe, Jens; Schmitz, Guido; Herzig, Christian

doi:10.1016/j.actamat.2007.01.032

Cited by 118 publications

(76 citation statements)

References 37 publications

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“…[14] The results indicate a different process of diffusion than vacancy diffusion prevailed in this study. Previous research [11] determined that the most important diffusion mechanism responsible for diffusion at low temperatures for polycrystalline Cu/Ni was grain boundary diffusion, and the results obtained in this study support this and compare well to diffusion parameters obtained by other research groups.…”

Section: Resultssupporting

confidence: 92%

Extracting interdiffusion parameters from Ni/Cu thin films by means of profile reconstruction with the MRI model

Joubert

Terblans

Swart

2010

Surface & Interface Analysis

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Thin film diffusion studies often involve a surface-sensitive analysis technique combined with ion erosion to produce a depth profile of a sample. Such studies compare the depth profile of a reference sample to the depth profiles of samples that were annealed at different temperatures and times. The extent to which atoms of one layer diffuse into an adjacent layer, for a particular temperature and time, yields information on the diffusion process involved and allows quantification of the diffusion coefficient. The drawback to using an erosion-type system is the effect of the incident ions on the surface being probed. The Mixing-Roughness-Information model attempts to compensate for this effect and is often employed as a means of quantification of measured depth profiles by means of profile reconstruction. Used in conjunction with Auger electron spectroscopy, the Mixing-Roughness-Information (MRI) model is a useful tool to reconstruct the ion erosion depth profiles as well as extracting interdiffusion parameters from these depth profiles. This study focuses on the extraction of the diffusion coefficient of Ni in Cu from Ni/Cu depth profiles obtained from ion erosion Auger electron spectroscopy. The resultant depth profiles were reconstructed with the MRI model. The diffusion coefficient for Ni diffusing in Cu was obtained from the MRI fit and it compared well to values available in literature.

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Section: Resultssupporting

confidence: 92%

Extracting interdiffusion parameters from Ni/Cu thin films by means of profile reconstruction with the MRI model

Joubert

Terblans

Swart

2010

Surface & Interface Analysis

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“…The present room-temperature Cu-Ni(Fe) result is the data point marked by the largest (solid red) circle in Figure 6. The diffusion coefficient computed at 23 • C rests just below the guideline for grain-boundary diffusion mechanism, and may well represents an extension of the grain-boundary diffusion data [38][39][40][41][42][43] for both Ni and Fe in Cu as well as Ni self-diffusion. The lack of grain growth, i.e., recrystallization, implies that the role of grain-boundary motion induced diffusion [48] is not a significant factor for the nanolaminates of this study whereas the use of grain boundaries and dislocation pipes provide paths for accelerated atomic transport between layers.…”

Section: Anomalous Diffusivitymentioning

confidence: 52%

“…ith the ratio of melt point fN-ScN systems is shown tion-, and grain boundaryoerschke, et al [31,32]; ; Divinski, et al [42]; et al [44]; present). erature is seen in Table 1 for shorter) wavelengths of the nhanced diffusion from the interfaces becomes too long ter wavelengths).…”

Section: Anomalous Diffusivitymentioning

confidence: 73%

“…Type-C is considered that for grain boundary diffusion. 63 Ni isotope diffusion with type-C behavior is measured in: polycrystalline Cu [42] over the temperature range of 476-635 K; nanocrystalline Cu [43] with 35-55 nm grain sizes over 420-470 K; and pure Cu subjected [44] to surface mechanical attrition treatment (SMAT) over 293-438 K. Diffusion coefficients from these studies are plotted in Figure 6 indicating that the 63 Ni in Cu data rests on the guideline for grain boundary diffusion. 59 Fe isotope diffusion in Cu [45] is measured in the temperature range of 529-758 K. Corresponding diffusion coefficient data plotted in Figure 6 shows that the 59 Fe in Cu diffusion data rests just above the dislocation diffusion guideline.…”

Section: Anomalous Diffusivitymentioning

confidence: 98%

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Interdiffusion at Room Temperature in Cu-Ni(Fe) Nanolaminates

Jankowski

2018

Coatings

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Abstract:The decomposition of a one-dimensional composition wave in Cu-Ni(Fe) nanolaminate structures is quantified using X-ray diffraction to assess kinetics of the interdiffusion process for samples aged at room temperature for 30 years. Definitive evidence for growth to the composition modulation within the chemical spinodal is found through measurement of a negative interdiffusivity for each of sixteen different nanolaminate samples over a composition wavelength range of 2.1-10.6 nm. A diffusivity valueĎ of 1.77 × 10 −24 cm 2 ·s −1 is determined for the Cu-Ni(Fe) alloy system, perhaps the first such measurement at a ratio of melt temperature to test temperature that is greater than 5. The anomalously high diffusivity value with respect to bulk diffusion is attributed to the nanolaminate structure that features paths for short-circuit diffusion through interlayer grain boundaries.

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“…In this study, a linear heating scheme for binary thin film diffusion couples described in Ref. [2] was expanded to bypass the effect that heat transfer mechanisms have on classical heat treatments, by using a programmed heat treatment that involves linearly ramping and cooling a sample under ultra high vacuum (UHV) 130.5 ± 13 [8] 2 × 10 −5 228.7 [9] 6.93 × 10 −7 90.4 [10] 1.4 × 10 −14 106.1 Figure 1. Representation of the change in the diffusion coefficient during a temperature ramp.…”

Section: Introductionmentioning

confidence: 99%

Determining the diffusion coefficient of Ni in Cu from a Ni/Cu thin film using linear heating, scanning Auger microscopy and a numerical solution of Fick's second law

Joubert

Terblans

Swart

2010

Surface & Interface Analysis

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In previous studies, linear temperature ramping was used to determine diffusion coefficients from bulk-to-surface segregation experiments of a low concentration solute. Thin film diffusion studies usually employ a classical heating regime, where a sample's annealing time is taken as the time between insertion and removal from a furnace. The aforementioned study type assumes that the time it takes to heat up a sample after insertion is instantaneous, while the sample cools down instantaneously after removal from the furnace. This assumption is incorrect, as it does not compensate for the various mechanisms that govern heat transfer. In order to eliminate the uncertainty, a linear ramping regime is used and samples were annealed inside an ultra high vacuum (UHV) environment with a programmed linear heating scheme. After each anneal, a depth profile was obtained by simultaneously bombarding the sample with Ar + ions and monitoring the exposed surface with an electron beam which excites Auger electrons, among others. The depth profiles were normalised and the time scale converted to depth. In order to compare the diffusion profiles obtained from classical annealing studies to the linearly ramped studies, the diffusion coefficient obtained for a classical study of Ni diffusing in Cu was inserted into a numerical solution of Fick's second law, modified to include linear temperature ramping. A diffusion coefficient was also obtained from linearly ramped samples. Comparison of the diffusion profiles calculated with the diffusion coefficients obtained from classical heating and linear heating showed a large discrepancy between the profiles.

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Grain boundary diffusion and segregation of Ni in Cu

Cited by 118 publications

References 37 publications

Extracting interdiffusion parameters from Ni/Cu thin films by means of profile reconstruction with the MRI model

Extracting interdiffusion parameters from Ni/Cu thin films by means of profile reconstruction with the MRI model

Interdiffusion at Room Temperature in Cu-Ni(Fe) Nanolaminates

Determining the diffusion coefficient of Ni in Cu from a Ni/Cu thin film using linear heating, scanning Auger microscopy and a numerical solution of Fick's second law

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