“…VOG growth can be achieved at lower temperatures (<800 • C) if the inductively coupled plasma chemical vapor deposition method (ICP CVD) is used, and it has become a key technique for the synthesis of high-quality coating without material damage and undesired defect formation [27][28][29]. Another advantage of CVD is due to the broad choice of available substrates for VOG preparation (e.g., SiO 2 and Al 2 O 3 [30], Si [31], Ni [32], stainless steel [33][34][35][36], Cu [37][38][39][40], Co [41], Al and TiO 2 [42], Al 2 O 3 [43], and Pt [44][45][46]). However, the VOG growth by ICP CVD is a complex, not well understood process because the changes in the VOG structure depend on a plasma source and a series of technological parameters including the type of a precursor gas (e.g., CH x (x = 1-3), CF 4 , CHF 3 , or C 2 F 6 ), gas composition and its partial pressure, the deposition time, and heating treatment [47].…”