The scalable and
conformal synthesis of two-dimensional (2D) transition
metal dichalcogenide (TMDC) heterostructures is a persisting challenge
for their implementation in next-generation devices. In this work,
we report the synthesis of nanometer-thick 2D TMDC heterostructures
consisting of TiS
x
-NbS
x
on both planar and 3D structures using atomic layer deposition
(ALD) at low temperatures (200–300 °C). To this end, a
process was developed for the growth of 2D NbS
x
by thermal ALD using (
tert
-butylimido)-tris-(diethylamino)-niobium
(TBTDEN) and H
2
S gas. This process complemented the TiS
x
thermal ALD process for the growth of 2D TiS
x
-NbS
x
heterostructures.
Precise thickness control of the individual TMDC material layers was
demonstrated by fabricating multilayer (5-layer) TiS
x
-NbS
x
heterostructures with
independently varied layer thicknesses. The heterostructures were
successfully deposited on large-area planar substrates as well as
over a 3D nanowire array for demonstrating the scalability and conformality
of the heterostructure growth process. The current study demonstrates
the advantages of ALD for the scalable synthesis of 2D heterostructures
conformally over a 3D substrate with precise thickness control of
the individual material layers at low temperatures. This makes the
application of 2D TMDC heterostructures for nanoelectronics promising
in both BEOL and FEOL containing high-aspect-ratio 3D structures.