2005
DOI: 10.1016/j.jcrysgro.2005.09.006
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Growth characteristics of ultra-thin epitaxial Ca Mg1−F2 alloys on Si(1 1 1) substrates

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Cited by 9 publications
(4 citation statements)
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“…The lattice mismatch for CaF 2 increases more than +1%, which is larger than the value at R.T. referred in Table I, under the high temperature growth conditions due to difference in thermal expansion. We noticed MgF 2 having smaller lattice constant as shown in Table I in order to achieve lattice matching, and were able to grow ultra-thin Ca x Mg 1-x F 2 alloy layers (12). Figure 9 shows surface roughness depending on alloy composition grown at 350 o C. The roughness decreased drastically when x=0.9 (10% MgF 2 contained), and pin-hole free Ca x Mg 1-x F 2 films was obtained.…”
Section: Post Oxidation Methodsmentioning
confidence: 94%
“…The lattice mismatch for CaF 2 increases more than +1%, which is larger than the value at R.T. referred in Table I, under the high temperature growth conditions due to difference in thermal expansion. We noticed MgF 2 having smaller lattice constant as shown in Table I in order to achieve lattice matching, and were able to grow ultra-thin Ca x Mg 1-x F 2 alloy layers (12). Figure 9 shows surface roughness depending on alloy composition grown at 350 o C. The roughness decreased drastically when x=0.9 (10% MgF 2 contained), and pin-hole free Ca x Mg 1-x F 2 films was obtained.…”
Section: Post Oxidation Methodsmentioning
confidence: 94%
“…One way to decrease the number of defects included in the device area is the reduction of device area. In this paper, we adopted a selected-area MBE growth technique for RTD fabrication on Si(111) substrates [17], because this technique was reported to decrease the leakage current and improve the reproducibility of CaF 2 /CdF 2 /CaF 2 RTDs [17,18].…”
mentioning
confidence: 99%
“…10,11) However, the I-V characteristics had very poor reproducibility, probably owing to the defects and pinholes in the CaF 2 barrier layers on the Si(111) substrates. [12][13][14] Thus, we employed a selective-area molecular beam epitaxy (MBE) growth method, presented in ref. 15, to reduce the leak current.…”
mentioning
confidence: 99%