2016
DOI: 10.7567/jjap.55.05fc02
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Growth of AlN layer on patterned sapphire substrate by hydride vapor phase epitaxy

Abstract: Even though a patterned sapphire substrate (PSS) has been used for the growth of a high-quality epilayer because of its many advantages, it has not been successfully used to grow an AlN epilayer for ultraviolet (UV) light-emitting diodes (LEDs) on a PSS up to now. We report the growth of a high-quality AlN epilayer on a PSS, as a substrate for the manufacture of UV LEDs, by hydride vapor phase epitaxy (HVPE). The X-ray diffraction (XRD) peaks for the AlN epilayer grown on the PSS indicate that crystalline AlN … Show more

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Cited by 10 publications
(11 citation statements)
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“…These data allow the determination of mean values of residual stress. For all reactor designs and all optimized conditions by the authors [18][19][20][21][22][23][24][25][26][27][28], FWHM values were in the range of 100 to 600 arcsec and 500 to 800 arcsec for on-axis and off-axis peak, respectively. It is clear that the optimal temperature range is 1200-1400 • C to increase the Al mobility on the surface while avoiding sapphire degradation and/or etching [38].…”
Section: Introductionmentioning
confidence: 96%
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“…These data allow the determination of mean values of residual stress. For all reactor designs and all optimized conditions by the authors [18][19][20][21][22][23][24][25][26][27][28], FWHM values were in the range of 100 to 600 arcsec and 500 to 800 arcsec for on-axis and off-axis peak, respectively. It is clear that the optimal temperature range is 1200-1400 • C to increase the Al mobility on the surface while avoiding sapphire degradation and/or etching [38].…”
Section: Introductionmentioning
confidence: 96%
“…In most recent papers [17][18][19][20][21][22][23][24][25][26][27][28] dealing with HVPE growth of AlN at high temperature from chlorinated precursors, intense efforts have been made to reduce defect densities caused by stress [29][30][31] before optimizing optical properties [18]. In situ etching to control void formation and stress release [17], multi-step methods to control island coalescence [32][33][34] or N/Al ratio [33,35], pulse injection of precursors [36], substrate position in turbulent flow [37] have been proposed to reduce strain, high dislocation densities and the appearance of cracks.…”
Section: Introductionmentioning
confidence: 99%
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“…For many decades, many efforts have been taken to improve the internal quantum efficiency ( η int ), light extraction efficiency ( η ext ), and conversion efficiency of phosphor ( η phos ), which improves the overall η L of PC-LEDs. For η int and η ext , the typical techniques focus on (a) improving the crystalline quality of epilayers by using low-temperature (LT) buffer layers [ 20 ], epitaxial lateral overgrowth [ 21 , 22 ], and patterned sapphire substrate (PSS) [ 23 , 24 ]; (b) optimization of the device structures including multiple quantum wells (MQWs) with stronger radiative recombination [ 25 , 26 ], electron blocking layer (EBL) suppressing current leakage [ 27 , 28 ], and p -type layer with high hole concentration [ 29 ]; and (c) high η ext design, involving PSS [ 23 , 24 ], microstructured air cavities [ 30 ], and mirror reflectors [ 31 , 32 ]. In terms of η phos , multiple types of phosphors have been introduced to improve color rendering index while manifesting high efficiency [ 33 , 34 ].…”
Section: Introductionmentioning
confidence: 99%