Heat conduction across metal and nonmetal interface containing imbedded graphene layers

Zhang, Chunwei; Zhao, Weiwei; Bi, Kedong; Ma, Jian; Wang, Jianli; Ni, Zhenhua; Zhang, Ni; Chen, Yunfei

doi:10.1016/j.carbon.2013.07.021

Cited by 35 publications

(35 citation statements)

References 27 publications

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“…This effect will be discussed in detail in the next section. The principle of Zhang et al ' s pump-probe measurement is similar to the differential 3 ω method: two measurement points were selected (as shown in Figure 2 ) with one having graphene layer insertion while the other point not [22] . The difference in temperature measurement stems from the thermal resistance of graphene interfaces.…”

Section: Pump-probe Methods To Characterize Interfacial Thermal Resistmentioning

confidence: 99%

“…As the metallic strip acts as the heater and the temperature monitor of the measurement, the top-down phonon transmission between two oxide layers might dominate the thermal transport, and the interfacial thermal contacts with graphene layer (two sides) is not as important. The same issue induced by the extra metallic coating also exists in the thermal characterization of graphene interfaces by using the pump-probe method [22,23,48] . The coated metallic layer on graphene is used for absorption of laser pulse and facilitating well-defined thermal probing.…”

Section: Graphene Interfaces Within the Sandwiched Structurementioning

confidence: 98%

“…However, how the deposition of additional metallic layer affects thermal transport across the atomiclayer interface remains unclear. In Zhang et al ' s work, the embedded graphene between the thermal evaporated Al film and Si substrate can enhance interfacial thermal transport, which means there is apparently negative thermal contact resistance between graphene and interfacial materials [22] . It is explained that the graphene prevents the diffusion of Au atoms into substrate and reduces the thickness of the intermixing layer.…”

Section: Graphene Interfaces Within the Sandwiched Structurementioning

confidence: 99%

“…To validate this speculation, they conducted the measurement for Brought to you by | New York University Bobst Library Technical Services Authenticated Download Date | 7/13/15 10:13 AM magnetron-sputtered Al films. It is found that the embedded graphene contributes to the interfacial thermal resistance for magnetron-sputtered Al film due to the increased number of interfaces [22] . Their results prove that different coatings on graphene layer would change the interfacial thermal transport significantly.…”

Section: Graphene Interfaces Within the Sandwiched Structurementioning

confidence: 99%

“…The atomic-thin structure of graphene flakes makes it difficult to characterize interfacial thermal transport. Moreover, the structural change in preparation and transfer processes of large-scale graphene flakes makes the interface situation even more complicated [22,23] . SiC annealing is an effective way to fabricate monolayer graphene with controllable conditions [24] .…”

Section: Introductionmentioning

confidence: 99%

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Thermal transport across atomic-layer material interfaces

Yue¹,

Zhang²,

Tang³

et al. 2015

Nanotechnology Reviews

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Emergence of two-dimensional (2D) materials with atomic-layer structures, such as graphene and MoS 2 , which have excellent physical properties, provides the opportunity of substituting silicon-based micro/nanoelectronics. An important issue before large-scale applications is the heat dissipation performance of these materials, especially when they are supported on a substrate, as in most scenarios. Thermal transport across the atomiclayer interface is essential to the heat dissipation of 2D materials due to the extremely large contact area with the substrate, when compared with their atomic-scale crosssections. Therefore, the understanding of the interfacial thermal transport is important, but the characterization is very challenging due to the limitations for temperature/thermal probing of these atomic-layer structures. In this review, widely used characterization techniques for experimental characterization as well as their results are presented. Emphasis is placed on the Raman-based technology for nm and sub-nm temperature differential characterization. Then, we present physical understanding through theoretical analysis and molecular dynamics. A few representative works about the molecular dynamics studies, including our studies on the size effect and rectification phenomenon of the graphene-Si interfaces are presented. Challenges as well as opportunities in the thermal transport study of atomic-layer structures are discussed. Though many works have been reported, there is still much room in both the development of experimental techniques as well as atomic-scale simulations for a clearer understanding of the physical fundamentals of thermal transport across the atomic-layer interfaces, considering the remarkable complexity of physical/chemical conditions at the interface.

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Section: Pump-probe Methods To Characterize Interfacial Thermal Resistmentioning

confidence: 99%

Section: Graphene Interfaces Within the Sandwiched Structurementioning

confidence: 98%

Section: Graphene Interfaces Within the Sandwiched Structurementioning

confidence: 99%

Section: Graphene Interfaces Within the Sandwiched Structurementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Thermal transport across atomic-layer material interfaces

Yue¹,

Zhang²,

Tang³

et al. 2015

Nanotechnology Reviews

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Significant Radiation Tolerance and Moderate Reduction in Thermal Transport of a Tungsten Nanofilm by Inserting Monolayer Graphene

Zhao

et al. 2016

Advanced Materials

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Tungsten-graphene multilayer composites are fabricated using a stacking method. The thermal resistance induced by the graphene interlayer is moderate. An ion-implantation method is used to verify the radiation tolerance. The results show that graphene inserted among tungsten films plays a dominant role in reducing radiation damage. Furthermore, the performance of different tungsten period-thicknesses in radiation tolerance is systematically analyzed.

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Thermal and Thermoelectric Properties of Graphene

Duan

2014

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267

192

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The subject of thermal transport at the mesoscopic scale and in low-dimensional systems is interesting for both fundamental research and practical applications. As the first example of truly two-dimensional materials, graphene has exceptionally high thermal conductivity, and thus provides an ideal platform for the research. Here we review recent studies on thermal and thermoelectric properties of graphene, with an emphasis on experimental progresses. A general physical picture based on the Landauer transport formalism is introduced to understand underlying mechanisms. We show that the superior thermal conductivity of graphene is contributed not only by large ballistic thermal conductance but also by very long phonon mean free path (MFP). The long phonon MFP, explained by the low-dimensional nature and high sample purity of graphene, results in important isotope effects and size effects on thermal conduction. In terms of various scattering mechanisms in graphene, several approaches are suggested to control thermal conductivity. Among them, introducing rough boundaries and weakly-coupled interfaces are promising ways to suppress thermal conduction effectively. We also discuss the Seebeck effect of graphene. Graphene itself might not be a good thermoelectric material. However, the concepts developed by graphene research might be applied to improve thermoelectric performance of other materials.

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Heat conduction across metal and nonmetal interface containing imbedded graphene layers

Cited by 35 publications

References 27 publications

Thermal transport across atomic-layer material interfaces

Thermal transport across atomic-layer material interfaces

Significant Radiation Tolerance and Moderate Reduction in Thermal Transport of a Tungsten Nanofilm by Inserting Monolayer Graphene

Thermal and Thermoelectric Properties of Graphene

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