Heat pipe dryout and temperature hysteresis in response to transient heat pulses exceeding the capillary limit

Baraya, Kalind; Weibel, Justin A.; Garimella, Suresh V.

doi:10.1016/j.ijheatmasstransfer.2019.119135

Cited by 33 publications

(7 citation statements)

References 38 publications

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“…The transient response of a flat copper heat pipe subjected to heating power inputs exceeding the capillary limit was studied by Baraya et al [104]. The temperature response of the 150 mm (L) Â 9 mm (W) Â 0.62 mm (H) heat pipe was then examined when a heating power of 10 W, higher than the capillary limit (of 5.1 W), was supplied for 10 s from an initial steady-state heating power of 3 W. Sharp increases in the evaporator and condenser temperatures were seen when the heating power was stepped up.…”

Section: Fixed Conductance Heat Pipes/vapor Chambersmentioning

confidence: 99%

A Review On Transient Thermal Management of Electronic Devices

Mathew

Krishnan

2021

Journal of Electronic Packaging

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Much effort in the area of electronics thermal management has focused on developing cooling solutions that cater to steady-state operation. However, electronic devices are increasingly being used in applications involving time-varying workloads. These include microprocessors (particularly those used in portable devices), power electronic devices such as IGBTs, and high-power semiconductor laser diode arrays. Transient thermal management solutions become essential to ensure the performance and reliability of such devices. In this review, emerging transient thermal management requirements are identified, and cooling solutions reported in the literature for such applications are presented with a focus on time scales of thermal response. Transient cooling techniques employing actively controlled two-phase microchannel heat sinks, phase change materials (PCM), heat pipes/vapor chambers, combined PCM-heat pipes/vapor chambers, and flash boiling systems are examined in detail. They are compared in terms of their thermal response times to ascertain their suitability for the thermal management of pulsed workloads associated with microprocessor chips, IGBTs, and high-power laser diode arrays. Thermal design guidelines for the selection of appropriate package level thermal resistance and capacitance combinations are also recommended.

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Section: Fixed Conductance Heat Pipes/vapor Chambersmentioning

confidence: 99%

A Review On Transient Thermal Management of Electronic Devices

Mathew

Krishnan

2021

Journal of Electronic Packaging

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“…Baraya et al studied the transient thermal response of a heat pipe subjected to heat input pulses of varying duration that exceed the capillary limit. It is demonstrated that under such transient heating conditions, a heat pipe can sustain heat loads higher than the steady-state capillary limit for brief periods of time without experiencing dryout [26]. Wang et al experimentally analyzed the heat transfer limit for high L/D potassium heat pipe operating with inclination angle [27].…”

Section: Introductionmentioning

confidence: 99%

Design and verification of ultra-high temperature lithium heat pipe based experimental facility

et al. 2022

THERM SCI

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Lithium heat pipe has broad applications in heat pipe cooled reactors and hypersonic vehicles due to its ultra-high working temperature which is around 1700 K. In this paper, a lithium heat pipe based experimental facility has been designed to test the heat transfer performance of the lithium heat pipe. A simplified mathematical model of heat pipe has been implemented into a CFD approach, which is used to verify the design of lithium heat pipe and its experimental facility. Results showed that the CFD approach is in good agreements with some well-known existing models and experimental data, and deviation between the results is within 5% range. The adjustment range of mixed gas thermal resistance and cooling water flow rate was obtained by analyzing the effects of different cooling conditions on the performance of the experimental facility. It is necessary to ensure the cooling water flow rate is above 0.11l/h to prevent water boiling when the heating power is10kW around, and the optimal proportion of helium is 70% -90%.The operation characteristics of the lithium heat pipe under unsteady state with varying heating power were simulated numerically. The results show that the proportion of helium must be less than 60% for normal operation of the lithium heat pipe. This work provides a reference and numerical verification for the design of lithium heat pipe based experimental facility, which can be used to reveal the heat transfer mechanisms of the lithium heat pipe during the experiment.

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“…Commonly used active and passive two-phase cooling technologies may not be sufficient for cooling ever-shrinking electronic devices with heat dissipation exceeding 1000 W/cm 2 [1][2][3]. Capillarydriven two-phase systems like heat pipes and vapor chambers achieve high heat transfer coefficients without the need of an external power; however, they are prone to severe challenges related to their capillary limit [4]. Although pumped two-phase technologies like micro/minichannel heat sinks have been demonstrated to remove large heat fluxes while operating with low pumping power, they are prone to flow boiling instabilities that have catastrophic impacts on the thermal performance of the cooling system [5].…”

Section: Introductionmentioning

confidence: 99%

Additive Manufacturing of Capillary-Driven Two-Phase Cold Plates

Catuche¹,

Shaeri²,

Ellis³

2022

Proceedings of the 8th World Congress on Mechanical, Chemical, and Material Engineering

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An additively manufactured capillary-driven two-phase cold plate was fabricated for use in a hybrid two-phase cooling system (HTPCS). The pumped two-phase loop continuously supplies the cold plate with a liquid refrigerant (R245fa), which is transported by capillary action through a wick structure to the heat source. High heat flux cooling is then provided by evaporation at the menisci formed within the wick. The cold plate includes eight heaters that are located at the top and bottom surface of the cold plate. The main significance of the HTPCS lies within cold plate, or evaporator, which prevents flooding of the evaporator wick by balancing pressure drop between the liquid supply manifold and wick, while separating the liquid supply region from the vapor generation region with a non-permeable barrier (NPB). This separation allows for heat transfer by evaporation rather than boiling and enables high heat flux transport. The cold plate, integrated with wick structures and the NPB, is made of an aluminum alloy (AlSi10Mg) through one single direct metal laser sintering process. The present study is performed as a proof-of-concept to evaluate the cooling performance of the additively manufactured cold plate in a recently developed HTPCS developed by the authors. The motivation of this work is to reduce the current multiple labor-intensive fabrication processes related to previous versions of this cold plate into only one single process. The cold plate removes ~ 210 W/cm 2 from the heaters; however, the inconsistent trends of thermal resistances, as well as different thermal resistances among heaters, indicate that there are effects caused by external parameter(s) that adversely affect the wicking performance of the evaporation region. Although further detailed research is required to address discrepancies among thermal resistances, current limitations in the fabrication process, such as using internal supports inside the cold plate as well as limitations to decrease the pore size below a threshold value, are identified as possible reasons for inconsistency in thermal resistances. Such limitations need to be addressed through further research into the additive manufacturing processes.

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Heat pipe dryout and temperature hysteresis in response to transient heat pulses exceeding the capillary limit

Cited by 33 publications

References 38 publications

A Review On Transient Thermal Management of Electronic Devices

A Review On Transient Thermal Management of Electronic Devices

Design and verification of ultra-high temperature lithium heat pipe based experimental facility

Additive Manufacturing of Capillary-Driven Two-Phase Cold Plates

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