Heat sink performances of GaN/InGaN flip-chip light-emitting diodes fabricated on silicon and AlN submounts

Jeng, Ming–Jer; Chiang, Kuo-Ling; Chang, Hsin-Yi; Yen, Chia-Yi; Lin, Chin Cheng; Chang, Yuan-Hsiao; Lai, Mu-Jen; Lee, Yu-Lin; Chang, Liann‐Be

doi:10.1016/j.microrel.2011.04.013

Cited by 20 publications

(6 citation statements)

References 16 publications

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“…Also, the peak wavelength (the chip wavelength) became longer (red shift), both of which increased about 2 nm. This is because with a rise in temperature, the electron and hole concentration increased, the band gap narrowed and the electron mobility decreased, and affecting the optical power and luminous flux [31].…”

Section: Resultsmentioning

confidence: 99%

Comparative study on the thermal performance of surface‐mounted devices light‐emitting diode packaging with poly(1,4‐cyclohexylenedimethylene terephthalate) and epoxy moulding compound frames

Zhao

Xiong

Chen

et al. 2021

IET Optoelectronics

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With the emergence of the different light-emitting diode (LED) packaging materials, the thermal analysis of LED device packaging with different materials has become urgent. The thermal performance of LED packaging with a poly(1,4-cyclohexylenedimethylene terephthalate) frame (PCT-LED) and LED packaging with an epoxy moulding compound frame (EMC-LED) were measured and simulated. The results show that compared with EMC-LED, PCT-LED has better optical and thermal performance. The luminous efficiency of PCT-LED and EMC-LED is 177.31 and 167.42 lm/W, respectively, under 150 mA at 25°C. PCT-LED devices have a lower thermal resistance of 15.64°C/W compared with that of EMC-LED, and under the different temperature and drive current conditions, the excellent thermal characteristic of PCT-LED devices is significant. Moreover, all simulation results agree well with the experimental results, and the maximum temperature of PCT-LED falls faster than that of EMC-LED with a fluid flow rate by thermal simulation. However, EMC-LED has better antiageing performance. These results are important to guide the application of PCT-LEDs and EMC-LEDs.This is an open access article under the terms of the Creative Commons Attribution-NonCommercial-NoDerivs License, which permits use and distribution in any medium, provided the original work is properly cited, the use is non-commercial and no modifications or adaptations are made.

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Section: Resultsmentioning

confidence: 99%

Comparative study on the thermal performance of surface‐mounted devices light‐emitting diode packaging with poly(1,4‐cyclohexylenedimethylene terephthalate) and epoxy moulding compound frames

Zhao

Xiong

Chen

et al. 2021

IET Optoelectronics

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show abstract

“…Ceramic materials commonly can serve as a package board material; however, the low thermal conductivity of the ceramics used in the LED packaging, e.g., alumina ð36 W=m-KÞ [98] and low-temperature co-fired ceramic ð30 W=m-KÞ [99], severely limit heat dissipation. Jeng et al developed a flip-chip LED package integrating high thermal conductivity AlN as the package board material [100]. Compared to conventional flip-chip LED package designs, the use of AlN as the package board material resulted in 52% increase in output power and a reduced red-shift of emission wavelength due to the high heat sinking capability.…”

Section: Thermal Management Of Gan-based Light-emitting Diodes For Aumentioning

confidence: 99%

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Lundh

Shervin

et al. 2019

Journal of Electronic Packaging

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GaN-based high-power wide-bandgap semiconductor electronics and photonics have been considered as promising candidates to replace conventional devices for automotive applications due to high energy conversion efficiency, ruggedness, and superior transient performance. However, performance and reliability are detrimentally impacted by significant heat generation in the device active area. Therefore, thermal management plays a critical role in the development of GaN-based high-power electronic and photonic devices. This paper presents a comprehensive review of the thermal management strategies for GaN-based lateral power/RF transistors and light-emitting diodes (LEDs) reported by researchers in both industry and academia. The review is divided into three parts: (1) a survey of thermal metrology techniques, including infrared thermography, Raman thermometry, and thermoreflectance thermal imaging, that have been applied to study GaN electronics and photonics; (2) practical thermal management solutions for GaN power electronics; and (3) packaging techniques and cooling systems for GaN LEDs used in automotive lighting applications.

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“…In a study of such devices on silicon and AlN substrates, Ming-Jer Jeng and collaborators at Chang Gung University in Korea found that fl ip-chip LEDs when properly bonded to high thermal conductivity substrates can show effi ciency improvements of up to 7 times that of conventional LEDs. 65 Heat from LEDs can also be removed through forced convection. While fan-cooled heat sinks have been around for a long time, new technologies based on vibrating diaphragm pumps have also been developed.…”

Section: Thermal Management Of Ledsmentioning

confidence: 99%

Solid-state lighting with wide band gap semiconductors

Rahman

2014

MRS Energy & Sustainability

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Gallium nitride is currently the wide band gap semiconductor material from which almost all commercial LEDs for solid-state lighting are manufactured but in the future other promising materials, such as zinc oxide (ZnO), are also likely to play a leading role.• With further developments in LED technology, leading to cheaper luminaires, perhaps based on gallium nitride-on-silicon material, LED lamps will largely replace tungsten incandescent bulbs in the years to come. ABSTRACTLight-emitting diodes (LEDs) made from wide band gap semiconductors, such as gallium nitride, are undergoing rapid development.Solid-state lighting with these LEDs is transforming patterns of energy usage and lifestyle throughout the world.With solid-state lighting gradually taking over from incandescent and fluorescent lighting, light-emitting diodes (LEDs) are very much the focus of research nowadays. This compact review takes a look at LEDs for lighting applications made from wide band gap semiconductors.A very brief history of electric lighting is included for completeness, followed by a description of blue-emitting LEDs that serve as pump sources for all 'white' LEDs. This is followed by a discussion on techniques to extract more light from the confines of LED chips through surface patterning. The thermal management of LEDs is perhaps the most important consideration in designing and using LED-based luminaires.This topic is discussed with regard to recent studies on LED reliability. The very promising development of gallium nitride-on-silicon LEDs is examined next followed by a discussion on phosphors for color conversion in LEDs. LED lighting has positively infl uenced both upscale and downscale illumination markets worldwide. Its societal impact is examined, with the review concluding with a look at efforts to produce LEDs from zinc oxide -a material that holds much promise for the future of solid-state lighting.vacuum tube era with devices based on gas-fi lled incandescent and fl uorescent bulbs illuminating our homes and workplaces. It is only over the last two decades that solid-state light generating devices in the form of light-emitting diodes (LEDs) have become available as an alternative for lighting up living spaces. 1 , 2 This review takes a look at their development, current status, and future prospects. After a brief historical introduction, the development and structure of the blue LED at the heart of all white LEDs are examined. This is followed by a description of various techniques that have been explored to extract more light from LED chips. Such techniques make LEDs brighter without increasing their energy consumption and thus enhance their attractiveness as energy-effi cient light sources. The relatively recent development of a gallium nitride-on-silicon material for low cost, high performance LEDs is examined next, followed by a look at the phosphor technology for white LEDs.The societal impact of LED lighting is then described with this review ending by examining the still distant goal of making LEDs out of zinc ox...

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Heat sink performances of GaN/InGaN flip-chip light-emitting diodes fabricated on silicon and AlN submounts

Cited by 20 publications

References 16 publications

Comparative study on the thermal performance of surface‐mounted devices light‐emitting diode packaging with poly(1,4‐cyclohexylenedimethylene terephthalate) and epoxy moulding compound frames

Comparative study on the thermal performance of surface‐mounted devices light‐emitting diode packaging with poly(1,4‐cyclohexylenedimethylene terephthalate) and epoxy moulding compound frames

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Solid-state lighting with wide band gap semiconductors

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