2015
DOI: 10.1016/j.physc.2015.04.003
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Heat transfer analysis of a programmable Josephson voltage standard chip operated with a mechanical cooler

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Cited by 8 publications
(6 citation statements)
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“…The operating current margin of the PJVS chip mounted on the copper substrate with slits is under investigation to get statistical data to confirm the advantages of the proposed packaging, while the temperature distribution in the chip [35] cannot be directly measured. As reported previously [26], there is a run-to-run variation in the area of the void between the silicon chip and the copper substrate; this void may cause a temperature increase and decrease the operating current margin for the PJVS.…”
Section: Methodsmentioning
confidence: 51%
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“…The operating current margin of the PJVS chip mounted on the copper substrate with slits is under investigation to get statistical data to confirm the advantages of the proposed packaging, while the temperature distribution in the chip [35] cannot be directly measured. As reported previously [26], there is a run-to-run variation in the area of the void between the silicon chip and the copper substrate; this void may cause a temperature increase and decrease the operating current margin for the PJVS.…”
Section: Methodsmentioning
confidence: 51%
“…The size of the silicon chip is 15 mm  15 mm  0:6 mm. The thickness of the InSn was measured by cutting the chip and substrate [26]. Although there were variation of the thickness, typical value of 0.01 mm was used for the calculation.…”
Section: Numerical Simulation Of Thermal Stressmentioning
confidence: 99%
“…The bias operating points in our PJVS system may be affected by the self-heating effect of the chip with a large number of junctions. Therefore, we conducted a heat transfer analysis of the proposed chip module and obtained the optimized operating conditions [26]. Figure 1 depicts the typical measurement result of a quantized voltage step with dither currents simultaneously applied for all junctions used for generating an AC waveform.…”
Section: Ac-programmable Josephson Voltage Standardmentioning
confidence: 99%
“…The temperature increase on the chip surface is estimated to be approximately 0.1 K on the basis of the estimated bias shift (0.15 mA) and the temperature dependence of the center values of the Shapiro steps (−1.7 mA/K) in our chip. To clarify the mechanism of these phenomena, we are now conducting a heat conduction analysis, which we will report elsewhere [17].…”
Section: Heating Effect In the Pjvs Chipmentioning
confidence: 99%