“…Many famous passivation techniques have been developed for surface passivation, for example, formation of thermally grown SiO 2 layers [20], hydrogenation treatment [21,22], fieldeffect passivation caused by fixed charges in SiN or aluminum oxide [23,24], and high-pressure H 2 O vapor heat treatment [25][26][27][28][29]. We have recently proposed simple heat treatment in liquid water at 110°C for low-temperature surface passivation techniques for silicon substrates [30,31].…”