Heterogeneous integration of microdisk lasers on silicon strip waveguides for optical interconnects

Abstract-We present high-efficiency grating couplers for coupling between a single-mode fiber and nanophotonic waveguides, fabricated both in silicon-on-insulator (SOI) and InP membranes using BenzoCycloButene wafer bonding. The coupling efficiency is substantially increased by adding a gold bottom mirror to the structures. The measured coupling efficiency to fiber is 69% for SOI grating couplers and 56% for bonded InP membrane grating couplers.

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“…Heterogeneous integration of III-V material (active functions) and SOI (passive functions) could be a viable solution [15].…”

Section: A Rationalementioning

confidence: 99%

Compact and Highly Efficient Grating Couplers Between Optical Fiber and Nanophotonic Waveguides

Laere

Roelkens

Ayre

et al. 2007

J. Lightwave Technol.

341

172

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“…Based on the concept of vertical coupling via evanescent coupling (originally proposed and demonstrated in the context of III-V microdisk lasers stacked on another III-V bus waveguide [87]), the mentioned French research groups managed to couple light from optically-pumped microdisk lasers into silicon strip waveguides by decreasing the total SiO 2 -SiO 2 hydrophilic surfaces from 800 nm down to 300 nm [88].…”

Section: Iii-v Lasers On Siliconmentioning

confidence: 99%

Emerging heterogeneous integrated photonic platforms on silicon

Fathpour

2015

Nanophotonics

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Silicon photonics has been established as a mature and promising technology for optoelectronic integrated circuits, mostly based on the silicon-on-insulator (SOI) waveguide platform. However, not all optical functionalities can be satisfactorily achieved merely based on silicon, in general, and on the SOI platform, in particular. Long-known shortcomings of silicon-based integrated photonics are optical absorption (in the telecommunication wavelengths) and feasibility of electrically-injected lasers (at least at room temperature). More recently, high two-photon and free-carrier absorptions required at high optical intensities for third-order optical nonlinear effects, inherent lack of second-order optical nonlinearity, low extinction ratio of modulators based on the freecarrier plasma effect, and the loss of the buried oxide layer of the SOI waveguides at mid-infrared wavelengths have been recognized as other shortcomings. Accordingly, several novel waveguide platforms have been developing to address these shortcomings of the SOI platform. Most of these emerging platforms are based on heterogeneous integration of other material systems on silicon substrates, and in some cases silicon is integrated on other substrates. Germanium and its binary alloys with silicon, III-V compound semiconductors, silicon nitride, tantalum pentoxide and other high-index dielectric or glass materials, as well as lithium niobate are some of the materials heterogeneously integrated on silicon substrates. The materials are typically integrated by a variety of epitaxial growth, bonding, ion implantation and slicing, etch back, spin-on-glass or other techniques. These wide range of efforts are reviewed here holistically to stress that there is no pure silicon or even group IV photonics per se. Rather, the future of the field of integrated photonics appears to be one of heterogenization, where a variety of different materials and waveguide platforms will be used for different purposes with the common feature of integrating them on a single substrate, most notably silicon.

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“…However, integrating lasers on fully-processed CMOS wafers presents additional challenges as the silicon bonding surfaces are buried underneath up to ten layers of electrical interconnects. One approach is to build electrical interconnects and photonic circuits on separate Si wafers, bond the Si wafers, and then use flip-chip bonding to secure the III-V semiconductor materials on the Si wafers (Hattori et al, 2006). Another method to avoid any wafer bonding steps and enable simultaneous heterogeneous integration is an post-CMOS, optofluidic assembly process using LOET.…”

Section: Microdisk Laser Assembly On Siliconmentioning

confidence: 99%

Optoelectronic Tweezers for the Manipulation of Cells, Microparticles, and Nanoparticles

Ohta¹,

Chiou²,

Jamshidi³

et al. 2010

Recent Optical and Photonic Technologies

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Heterogeneous integration of microdisk lasers on silicon strip waveguides for optical interconnects

Cited by 66 publications

References 9 publications

Compact and Highly Efficient Grating Couplers Between Optical Fiber and Nanophotonic Waveguides

Compact and Highly Efficient Grating Couplers Between Optical Fiber and Nanophotonic Waveguides

Emerging heterogeneous integrated photonic platforms on silicon

Optoelectronic Tweezers for the Manipulation of Cells, Microparticles, and Nanoparticles

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