“…[10] Although the fluorinated complex [Hf(tfac) 4 ] is more volatile, [11] the presence of fluorine can lead to etching of the silicon substrate. The metal nitrate complex [Hf(NO 3 ) 4 ] has been used for the MOCVD of high purity HfO 2 at low growth temperatures, [12] but anhydrous metal nitrate complexes are hazardous, highly reactive oxidants. Metal alkylamide complexes, such as [Hf(NMe 2 ) 4 ] [13,14] and [Hf(NEt 2 ) 4 ], [13] have also been used for the MOCVD of HfO 2 , but they are highly air-sensitive, and varying amounts of residual nitrogen and carbon can be incorporated in the oxide film.…”