“…In addition to on-chip decompressors, application of compression techniques in SoC designs requires specialized instrumentation such as TAMs (to transport test data between the SoC pins and the embedded cores [9], [37]) and test wrappers (to interface the core and the SoC environment [19], [32], [43]). Typically, TAM and wrapper design schemes are tailored towards optimal test application time [10], [20], [47], test interface [8], [39], power dissipation [6], [18], [26], [31], [35], [49], control logic [28], [46], routing and layout, internal cores hierarchy [3], [4], [11], [38], or mixed-signal tests. There is also a growing interest in solutions that address both TAM/wrapper design and test data compression [22], [42].…”