2021
DOI: 10.1364/oe.438157
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High average output power from a backside-cooled 2-µm InGaSb VECSEL with full gain characterization

Abstract: We compare the gain and continuous wave lasing properties of two InGaSb-based vertical external cavity surface emitting lasers (InGaSb VECSEL) with different heat management approaches operating at a center wavelength of around 2 μ m . To date, intracavity heatspreaders have been required for good average output power, which have many trade-offs, especially for passive modelocking. Here we demonstrate a record high average output power of 810 mW without an intracavity heatsp… Show more

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Cited by 18 publications
(9 citation statements)
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“…A standard 2-µm VECSEL structure [17] in comparison, has a total thickness of 6.7 µm. The active region consists of 4 sets of 3 In 0.27 Ga 0.73 Sb quantum wells (4 × 3 QWs), where each QW has a thickness of 8 nm.…”
Section: Design Fabrication and Experimental Setupmentioning
confidence: 99%
See 2 more Smart Citations
“…A standard 2-µm VECSEL structure [17] in comparison, has a total thickness of 6.7 µm. The active region consists of 4 sets of 3 In 0.27 Ga 0.73 Sb quantum wells (4 × 3 QWs), where each QW has a thickness of 8 nm.…”
Section: Design Fabrication and Experimental Setupmentioning
confidence: 99%
“…After bonding, the GaSb substrate is removed by lapping down to 20-40 µm followed by wet-etching the remaining substrate with a solution mixture of 33 % CrO 3 and 50 % hydrofluoric acid, diluted in water 1 : 5 [17]. The InAs 0.91 Sb 0.09 etch stop is then removed with a solution of citric acid and hydrogen peroxide yielding the finished MECSEL chip on a single SiC heatspreader.…”
Section: Design Fabrication and Experimental Setupmentioning
confidence: 99%
See 1 more Smart Citation
“…The saturation fluence is especially important for the quasi-soliton pulse shaping mechanism in modelocked VECSELs [11]. A detailed description of the structure design, the wafer removal process, and chip characterization is given in [12]. The In0.27Ga0.73Sb QW SESAM is also MBE grown and directly soldered (GaSb wafer side) to a copper heat sink.…”
Section: Vecsel Cavity Designmentioning
confidence: 99%
“…Also for the proper timing of single-photon light sources by time multiplexing [51] low repetition rates are needed. Of course, low repetition rate lasers have been available for long, but these are exclusively bulk lasers requiring optical pumping, specifically, rareearth doped solid state lasers, fiber lasers, and optically pumped semiconductor lasers [163]. These are less suitable for high functionality, complex optical systems.…”
Section: Applications Of Low Repetition Rate Diode Lasersmentioning
confidence: 99%