“…The effect of bending stress on thin-film devices can be assessed by wrapping films around cylinders of specific diameters ranging from hundreds of microns to several millimeters and then either measuring the resistance across the traces or the testing the performance (Ai et al, 2008;Chen et al, 2010;Kim et al, 2010;Lacour et al, 2010;Ochoa et al, 2013). Alternatively, films can be wrapped around spheres (Ochoa et al, 2013;Rodger et al, 2007) and inflatable balloons (Kim et al, 2011). Some devices are self-curling and were shown to maintain function while being bent 90° (Takeuchi et al, 2004) or down to a radius of 2 mm or less (Johnson and Wise, 2012;Yamagiwa et al, 2013).…”