1997
DOI: 10.1063/1.118399
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High gain-bandwidth-product silicon heterointerface photodetector

Abstract: Effects of Si doping on normal incidence In As ∕ In 0.15 Ga 0.85 As dots-in-well quantum dot infrared photodetectors J. Appl. Phys. 99, 083105 (2006); 10.1063/1.2189973High-performance 30-period quantum-dot infrared photodetector

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Cited by 101 publications
(34 citation statements)
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“…The InGaAs has high light absorption at 1.3 and 1.55 mm. On the other hand, Si has longer lifetime and higher electron/hole ionization ratio leading to higher avalanche multiplication efficiency [4]. In Table 1 there is a list of recent devices presented, using InP-to-Si direct wafer bonding.…”
Section: Applications Of Inp-to-si Wafer Bondingmentioning
confidence: 99%
“…The InGaAs has high light absorption at 1.3 and 1.55 mm. On the other hand, Si has longer lifetime and higher electron/hole ionization ratio leading to higher avalanche multiplication efficiency [4]. In Table 1 there is a list of recent devices presented, using InP-to-Si direct wafer bonding.…”
Section: Applications Of Inp-to-si Wafer Bondingmentioning
confidence: 99%
“…[1][2][3][4][5][6][7][8][9] As well known, most of the photonic components fabricated with Si technology have been demonstrated, such as optical modulators, 1,2 switches, 3,4 low-loss waveguides, 5,6 and detectors. 7,8 The observation of photoluminescence (PL) from porous Si at room temperature has attracted much research attention to fabricate Si-based light emitting devices employing low dimensional Si materials, in which the quantum confinement effect was initially thought to be the main mechanism of the strong luminescence. 9 A lot of efforts based on various techniques have been made to synthesize low dimensional Si, preferably Si nanocrystals (nc-Si).…”
Section: Introductionmentioning
confidence: 99%
“…[1][2][3][4][5][6][7][8][9] In this work, we will describe reductions in thermal conductivity in bulk silicon achieved by bonding a stack of thin wafers as illustrated in Fig. 1(a), in which numerous nanometer air gaps 10 in the bonded interface were used for impeding normal heat flow.…”
Section: Reduction Of Thermal Conductivity Inmentioning
confidence: 99%