International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138)
DOI: 10.1109/iedm.2000.904404
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High-k gate dielectrics with ultra-low leakage current based on praseodymium oxide

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Cited by 65 publications
(66 citation statements)
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“…% Er), have been shown to display an even higher dielectric constant (j ¼ 33-37.6). 5,6 Also, Er 2 O 3 thin films exhibit a relatively large conduction band offset on silicon (> 2 eV), 2,4,7,8 and a lattice constant that is conducive to epitaxial growth on Si (the Er 2 O 3 lattice constant of $ 10.54 Å is about twice that of Si). 9 Similarly, erbium oxide is under active consideration as a source of efficient room-temperature light emission.…”
Section: Introductionmentioning
confidence: 99%
“…% Er), have been shown to display an even higher dielectric constant (j ¼ 33-37.6). 5,6 Also, Er 2 O 3 thin films exhibit a relatively large conduction band offset on silicon (> 2 eV), 2,4,7,8 and a lattice constant that is conducive to epitaxial growth on Si (the Er 2 O 3 lattice constant of $ 10.54 Å is about twice that of Si). 9 Similarly, erbium oxide is under active consideration as a source of efficient room-temperature light emission.…”
Section: Introductionmentioning
confidence: 99%
“…Fabrication of Pr 2 O 3 films on Si has been performed using molecular beam epitaxy (MBE) [14±16] and pulsed laser deposition. [17,18] Deposited Pr 2 O 3 films are potentially better than other high-k films due to the leakagecurrent densities [19] (< 10 ±8 A cm ±2 at gate voltage (V g ) = +1 V), 10 4 times lower than the observed values for HfO 2 and ZrO 2 films having the same equivalent oxide thickness of 1.4 nm. [20,21] Moreover, Osten et al [22] have reported on Pr 2 O 3 compatibility with conventional complementary metal oxide semiconductor (CMOS) processes, thus demonstrating that it is not necessary to re-engineer manufacturing procedures.…”
mentioning
confidence: 97%
“…[25] So far, however, studies for microelectronic applications have not been reported. In particular, the Pr 2 O 3 phase exhibits attractive features, such as a high dielectric constant (26)(27)(28)(29)(30), [26] a relatively large (3.9 eV) fundamental bandgap, [27] a symmetrical band offset 1 eV larger with respect to Si, [28] and a large formation energy (-12 900 kJ mol -1 ). [29] Praseodymium oxide layers can be grown using various routes.…”
Section: Introductionmentioning
confidence: 99%
“…The earlier physical vacuum evaporation methods adopted oxidation of the Pr metal layer. [30][31][32] Advanced methods for the fabrication of stoichiometric Pr 2 O 3 and/or PrO 2 films consist of pulsed laser deposition (PLD) [33][34][35] and molecular-beam epitaxy (MBE) [26,[36][37][38] techniques. In particular, the MBE growth of epitaxial Pr 2 O 3 films has been carried out on both Si(001) and Si (111) substrates.…”
Section: Introductionmentioning
confidence: 99%