High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications

Decrossas, Emmanuel; Glover, Michael D.; Porter, Kaoru; Cannon, Tom; Stegeman, Thomas; Allen-McCormack, Nicholas; Hamilton, Michael C.; Mantooth, H. Alan

doi:10.1109/tcpmt.2015.2394234

Cited by 26 publications

(7 citation statements)

References 3 publications

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“…Harsh operating environments demand the use of high thermal conductivity package board materials to improve and ensure the reliability of LED headlamps. Ceramic materials commonly can serve as a package board material; however, the low thermal conductivity of the ceramics used in the LED packaging, e.g., alumina ð36 W=m-KÞ [98] and low-temperature co-fired ceramic ð30 W=m-KÞ [99], severely limit heat dissipation. Jeng et al developed a flip-chip LED package integrating high thermal conductivity AlN as the package board material [100].…”

Section: Thermal Management Of Gan-based Light-emitting Diodes For Aumentioning

confidence: 99%

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Lundh

Shervin

et al. 2019

Journal of Electronic Packaging

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GaN-based high-power wide-bandgap semiconductor electronics and photonics have been considered as promising candidates to replace conventional devices for automotive applications due to high energy conversion efficiency, ruggedness, and superior transient performance. However, performance and reliability are detrimentally impacted by significant heat generation in the device active area. Therefore, thermal management plays a critical role in the development of GaN-based high-power electronic and photonic devices. This paper presents a comprehensive review of the thermal management strategies for GaN-based lateral power/RF transistors and light-emitting diodes (LEDs) reported by researchers in both industry and academia. The review is divided into three parts: (1) a survey of thermal metrology techniques, including infrared thermography, Raman thermometry, and thermoreflectance thermal imaging, that have been applied to study GaN electronics and photonics; (2) practical thermal management solutions for GaN power electronics; and (3) packaging techniques and cooling systems for GaN LEDs used in automotive lighting applications.

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Section: Thermal Management Of Gan-based Light-emitting Diodes For Aumentioning

confidence: 99%

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Lundh

Shervin

et al. 2019

Journal of Electronic Packaging

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“…Low temperature co-fire ceramic (LTCC) (Ji et al , 2008; Decrossas et al , 2015; Zhu et al , 2011) is a multilayer ceramic technology that overcomes the limitation and provides an ability to implant passive components in layers and active elements on the surface layer. Recently, the usage of LTCC technology in RF circuit design is attractive due to its better performance and reliability.…”

Section: Introductionmentioning

confidence: 99%

An ultra-low noise pseudomorphic high electron mobility transistor (pHEMT)-based low noise amplifier using low temperature co-fire ceramic (LTCC) technique

Subburaman¹,

Sundharajan²

2021

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Purpose This study aims to present two stage pseudomorphic high electron mobility transistor-based low noise amplifier (LNA) designed using low temperature co-fire ceramic (LTCC) technique for ultra-high frequency (UHF) band. The LNA operates in the frequency range of (400∼500) MHz which is suitable for wireless communication applications. Design/methodology/approach This LNA uses resistive capacitive (RC) feedback in the first stage to have wide bandwidth and interstage network for gain enhancement. By using external RC feedback, stability is improved and noise matching in the input stage is isolated by decoupling inductor. The excellent performance parameters including gain, noise figure (NF), wideband and linearity are attained without affecting the power consumption, compactness and cost of the proposed design. Findings Simulation is carried out using advanced design software and the result shows that gain of 33.7 dB, NF 0.416 dB and 1 dB compression point (P1dB) of 18.59 dBm are achieved with a supply voltage of 2.5 V. The return loss of input and output are −19.3 dB and −10.5 dB, respectively. From the above aforementioned parameters, it is confirmed that the proposed LNA is a promising candidate for receivers where high gain and very low NF are always demandable with good linearity for applications operating in the UHF band. Originality/value The innovation of the proposed LNA is that the concurrent attainment of high gain, low NF, wideband, optimum input matching, good stability by RC feedback and interstage network using LTCC technique to achieve robustness, low cost and compactness to prove the applicability of design for wireless applications.

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“…Reference [45] utilized the interconnection with copper balls as a feed line for a dipole array antenna at 60 GHz. As with a copper balls' interconnection [44], the quasi-coaxial transmission line [46] was designed, whereas an oval shape ground via was designed for the LTCC substrate [47]. In [48], the via resonance of the quasi-coaxial line in a multi-layered substrate was analyzed up to 50 GHz, whereas a ground conductor placement type was discussed and measured in [49].…”

Section: Introductionmentioning

confidence: 99%

Experimental Verification of Excavated Structure on Multi-Layered Substrates for Millimeter-Wave Signal Vertical Transition Using Copper Balls

Yoshida

Nishikawa

2020

IEEE Access

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This paper presents a vertical transition of millimeter-wave signal for interconnection between multi-layered substrates, which utilizes copper balls for vertical interconnection, as both for electrical connection and physical support. In particular, the copper balls were used to configure a quasi-coaxial transmission line at the vertical interconnection. The key idea was to create an excavated structure at the location of the copper balls to fix it, given that the copper balls slightly fluctuate during reflow soldering when simply placed on a flat surface. Such activity of the copper balls defines large variation in transmission characteristics at millimeter-wave band that produce low yield rate. Practically, with the proposed method of an excavated structure, the location error of the copper balls can be minimized, leading to high reproducibility in determining the copper balls location, and small variation of the transmission characteristics. To verify the method's effectiveness, a prototype having three vertically stacked multi-layered substrates with the excavated structure was fabricated. The excavation had a depth of 90 µm and diameter of 0.45 mm. The copper balls used had a 0.3-mm diameter. Five samples were fabricated and then evaluated by X-ray images and S-parameter measurements. Based on the results, the reflection characteristics of the measurement were less than −10 dB from dc to 97 GHz in the best-case scenario, whereas the variation in the S-parameters was comparatively small up to 70 GHz. Moreover, the X-ray images showed relatively small copper balls location error. These results indicate that the proposed excavated structure is effective for millimeter-wave vertical interconnections using copper balls, in small wireless terminal applications.

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High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications

Cited by 26 publications

References 3 publications

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

An ultra-low noise pseudomorphic high electron mobility transistor (pHEMT)-based low noise amplifier using low temperature co-fire ceramic (LTCC) technique

Experimental Verification of Excavated Structure on Multi-Layered Substrates for Millimeter-Wave Signal Vertical Transition Using Copper Balls

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