High‐performance Cu/Al laminated composites fabricated by horizontal twin‐roll casting

Abstract

Horizontal twin-roll casting technology was successfully introduced to produce high-performance copper/aluminum (Cu/Al) laminated composites. The interface morphology, electrical properties and peeling strength after different annealing and cold rolling processes were investigated and contrasted with Cu/Al clad plates fabricated by conventional methods. The results show that sound metallurgical bonding between the copper and aluminum matrix can be attained after the horizontal twin-roll casting processes and Al 2 Cu is the only intermetallics at the interfacial region, the thickness of interfacial interlayer is about 0.7 mm. The peeling strength is 31.4 N/mm and can be further increased to 37.1 N/mm after annealing at 250 8C. However, higher temperature like 400 8C will cause the excessive growth of intermetallics so that peeling strength sharply decreases to 9.2 N/mm. Electrical conductivity of the clad plate is 51 MS/m. At the same electrical current intensity, the temperature-rise of the composite plate is between the pure copper plate and the aluminum plate, and closer to the copper plate. All of the properties are outstanding than that of Cu/Al clad plate fabricated by conventional methods.

Preparation and film formation mechanism of an environmental‐friendly polyester/epoxy ester coil coating primer

“…For coil coating, it was usually prepared adopting special technology of rapid film formation process at high temperature, and thus it requires strict high temperature baking conditions [18]. Lower plate metal temperature (PMT) is usually not adequate for the primer to reach the required crosslinking de-gree, and thus the obtained coating has a poor salt spray resistance.…”

“…It can improve the reactivity between binder resin and crossinking resin, reduce the baking temperature or shorten the baking time, so as to meet the technological requirements of film rapid formation and energy saving. Acid catalyst is usually used for promoting amino resin crosslinking, and organotin catalyst is often used for promoting blocked isocyanate crosslinking [18]. Therefore, curing catalyst is the one of the most important additives in practice.…”

Effect of Annealing on the Interface and Mechanical Properties of Cu-Al-Cu Laminated Composite Prepared with Cold Rolling

“…As shown by the fitted curve in Figure 6, the thickness of the intermetallics layer increases following an exponential relationship in the temperature range between 200 • C (473 K) and 450 • C (723 K). The relationship is mainly attributed to increased thermal energy of Cu and Al atoms at higher temperature [21]. With the increase of annealing temperature, the Cu and Al atoms can obtain more thermal energy to break through the barrier of diffusion energy, which can achieve a wide range of free migration and accelerate the growth of the diffusion layer.…”