Horizontal twin-roll casting technology was successfully introduced to produce high-performance copper/aluminum (Cu/Al) laminated composites. The interface morphology, electrical properties and peeling strength after different annealing and cold rolling processes were investigated and contrasted with Cu/Al clad plates fabricated by conventional methods. The results show that sound metallurgical bonding between the copper and aluminum matrix can be attained after the horizontal twin-roll casting processes and Al 2 Cu is the only intermetallics at the interfacial region, the thickness of interfacial interlayer is about 0.7 mm. The peeling strength is 31.4 N/mm and can be further increased to 37.1 N/mm after annealing at 250 8C. However, higher temperature like 400 8C will cause the excessive growth of intermetallics so that peeling strength sharply decreases to 9.2 N/mm. Electrical conductivity of the clad plate is 51 MS/m. At the same electrical current intensity, the temperature-rise of the composite plate is between the pure copper plate and the aluminum plate, and closer to the copper plate. All of the properties are outstanding than that of Cu/Al clad plate fabricated by conventional methods.

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A high-throughput method was employed to effectively obtain the cross-scale relationship of elastic copper alloys. Firstly, a Cu–Ni–Ti–Cu25Al–Cu35Sn diffusion multiple was prepared and heat-treated under a specified condition to form a series of diffusion layers with the concentration gradient at the multielement metal interface. Then, the compositions, elastic moduli, and hardness of the Cu–Ni–Al and Cu–Ti–Al ternary copper alloys were tested. Meanwhile, the solid phase sequences in the diffusion zones were predicted by the CALPHAD (CALculation of PHAse Diagram) method. Through these experimental and calculated results, the composition–phase–property relations of the Cu–Ni–Al and Cu–Ti–Al ternary systems were established.